Acetic Acid

Acetic Acid

SCHEMBL651110

CC(=O)O.CC(C)(C)OOC(C)(C)C

nearest known ligand 0.57

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ADRA2AADRA2BADRA2CADRB2AGTR1AVPR1AAVPR1BAVPR2BDKRB2CALCRCHRNA3CHRNB4ESR1ESR2GHSRGNRHRGSC1HSPA8MALT1MC1RMC4RNOS1NOS2NOS3OPRK1OXTRRAMP1RAMP2RAMP3SCN5ASSTR1SSTR2SSTR3SSTR4SSTR5dacAdacBdacCfolPftsImrcAmrcBmrdArplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO

The experimentally established mechanism targets of Acetic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 6/20 0.57
TDP1 Q9NUW8 2/20 0.57
FFAR3 O14843 1/20 0.50
LCK P06239 1/20 0.50
FYN P06241 1/20 0.50
ALDH1A1 P00352 5/20 0.41
HSD17B10 Q99714 1/20 0.41
LMNA P02545 1/20 0.33
GAA P10253 2/20 0.32
DGAT1 O75907 1/20 0.32
HMGCR P04035 1/20 0.32
CHRM1 P11229 1/20 0.32
TBXA2R P21731 1/20 0.32
ADRA1A P35348 1/20 0.32
MGAM O43451 1/20 0.32
SI P14410 1/20 0.32
MGAM2 Q2M2H8 1/20 0.32
THPO P40225 1/20 0.31
CYP2D6 P10635 1/20 0.30
CYP2C19 P33261 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Acetic Acid SCHEMBL11198740 0.97 TSHR (0.53) TSHRTDP1FFAR3LCKFYN
Bicarbonate SCHEMBL27668414 0.89 TSHR (0.61) TSHRTDP1FFAR3LCKFYN
Acetone SCHEMBL27912055 0.89 TSHR (0.61) TSHRTDP1FFAR3LCKFYN
Oxalic Acid SCHEMBL27320483 0.86 TSHR (0.57) TSHRTDP1FFAR3LCKFYN
Hydrogen Peroxide SCHEMBL2635895 0.84 TSHR (0.80) TSHRTDP1ALDH1A1HSD17B10
Pivalate SCHEMBL300936 0.83 TSHR (0.53) TSHRTDP1ALDH1A1HSD17B10DGAT1
Methacrylic Acid SCHEMBL16007806 0.82 TDP1 (0.44) TSHRTDP1FFAR3LCKFYN
SCHEMBL28283124 0.81 TSHR (0.73) TSHRTDP1ALDH1A1
Acetic Acid SCHEMBL11198741 0.80 TSHR (0.50) TSHRTDP1ALDH1A1HSD17B10
Acetic Acid SCHEMBL25274821 0.80 HMGCR (0.42) TSHRTDP1FFAR3LCKFYN

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250197677-A1 Two-Part Curable Adhesive Composition HENKEL AG & CO KGAA (DE) 2025-06-19 US claimed
WO-2024050683-A1 TWO-PART CURABLE ADHESIVE COMPOSITION HENKEL AG & CO. KGAA (DE) 2024-03-14 WO claimed
US-6920901-B2 Heat resistant fuel hose TOKAI RUBBER INDUSTRIES, LTD. (JP) 2005-07-26 US claimed
US-6867263-B2 Method of vulcanized bonding of heat-resistant rubber TOKAI RUBBER INDUSTRIES, LTD. (JP) 2005-03-15 US claimed
US-20030188793-A1 Heat resistant fuel hose TOKAI RUBBER INDUSTRIES, LTD. (JP) 2003-10-09 US claimed
US-20030187146-A1 Method of vulcanized bonding of heat-resistant rubber TOKAI RUBBER INDUSTRIES, LTD. (JP) 2003-10-02 US claimed
EP-4665573-A1 METHOD FOR ENCAPSULATING ELECTRICAL CELLS BEARING A NICKEL-BASED SURFACE Huntsman Advanced Materials (Switzerland) GmbH (CH) 2025-12-24 EP disclosed
US-20250197677-A1 Two-Part Curable Adhesive Composition HENKEL AG & CO KGAA (DE) 2025-06-19 US disclosed
CN-119836457-A Two-component curable adhesive composition 汉高股份有限及两合公司 2025-04-15 CN disclosed
CN-119432064-A High-impact-resistance high-toughness bio-based nylon composite material and preparation method thereof 中国科学院宁波材料技术与工程研究所 2025-02-14 CN disclosed
US-20240336815-A1 FOAMED ACRYLIC POLYMER PRIMERLESS ADHESIVE ILLINOIS TOOL WORKS INC. (US) 2024-10-10 US disclosed
WO-2024170393-A1 METHOD FOR ENCAPSULATING ELECTRICAL CELLS BEARING A NICKEL-BASED SURFACE HUNTSMAN ADVANCED MATERIALS LICENSING (SWITZERLAND) GMBH (CH) 2024-08-22 WO disclosed
WO-2024050683-A1 TWO-PART CURABLE ADHESIVE COMPOSITION HENKEL AG & CO. KGAA (DE) 2024-03-14 WO disclosed
US-20050068593-A1 Holographic optical recording medium, manufacturing method thereof and holographic optical recording method KABUSHIKI KAISHA TOSHIBA 2005-03-31 US disclosed
US-6867263-B2 Method of vulcanized bonding of heat-resistant rubber TOKAI RUBBER INDUSTRIES, LTD. (JP) 2005-03-15 US disclosed
EP-1359183-A1 Method of vulcanized bonding of heat-resistant rubber Tokai Rubber Industries, Ltd. (JP) 2003-11-05 EP disclosed
US-20030188793-A1 Heat resistant fuel hose TOKAI RUBBER INDUSTRIES, LTD. (JP) 2003-10-09 US disclosed
US-20030187146-A1 Method of vulcanized bonding of heat-resistant rubber TOKAI RUBBER INDUSTRIES, LTD. (JP) 2003-10-02 US disclosed
EP-1348538-A1 Heat resistant fuel hose Tokai Rubber Industries, Ltd. (JP) 2003-10-01 EP disclosed
US-6375872-B1 Microencapsulated adhesive MOORE BUSINESS FORMS 2002-04-23 US disclosed