SCHEMBL6541581

SCHEMBL6541581

C=CC(OCCCCCCCC)c1ccccc1

nearest known ligand 0.42

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 2/20 0.42
RAB9A P51151 2/20 0.42
SMN1; SMN2 Q16637 2/20 0.42
TSHR P16473 2/20 0.41
TP53 P04637 1/20 0.41
LTA4H P09960 1/20 0.40
LMNA P02545 2/20 0.40
PLA2G4B P0C869 1/20 0.40
HTR2A P28223 1/20 0.39
ALDH1A1 P00352 1/20 0.38
KCNH2 Q12809 1/20 0.38
CASR P41180 1/20 0.38
RARB P10826 3/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28035354 1.00 NPC1 (0.42) NPC1RAB9ASMN1; SMN2TSHRTP53
SCHEMBL28035370 1.00 NPC1 (0.42) NPC1RAB9ASMN1; SMN2TSHRTP53
SCHEMBL28035385 1.00 NPC1 (0.42) NPC1RAB9ASMN1; SMN2TSHRTP53
SCHEMBL28034832 1.00 NPC1 (0.42) NPC1RAB9ASMN1; SMN2TSHRTP53
SCHEMBL28034827 1.00 NPC1 (0.42) NPC1RAB9ASMN1; SMN2TSHRTP53
SCHEMBL28034833 1.00 NPC1 (0.42) NPC1RAB9ASMN1; SMN2TSHRTP53
SCHEMBL28034845 1.00 NPC1 (0.42) NPC1RAB9ASMN1; SMN2TSHRTP53
SCHEMBL6678195 1.00 NPC1 (0.42) NPC1RAB9ASMN1; SMN2TSHRTP53
SCHEMBL6541323 1.00 NPC1 (0.42) NPC1RAB9ASMN1; SMN2TSHRTP53
SCHEMBL28034887 1.00 NPC1 (0.42) NPC1RAB9ASMN1; SMN2TSHRTP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250154361-A1 RECESS FILLING MATERIAL KIT, CURED PRODUCT THEREOF, AND RECESS FILLING METHOD RESONAC CORPORATION (JP) 2025-05-15 US disclosed
CN-114685745-B Method for producing urethane (meth) acrylate and urethane (meth) acrylate resin 株式会社力森诺科 2024-09-17 CN disclosed
CN-114829432-B Radical polymerizable resin composition and cured product thereof 株式会社力森诺科 2024-09-17 CN disclosed
WO-2024142769-A1 RESIN COMPOSITION, COMPOSITE MATERIAL, AND CURED PRODUCTS OF THESE 株式会社レゾナック 2024-07-04 WO disclosed
CN-118255944-A Resin composition, composite material, and cured product thereof 株式会社力森诺科 2024-06-28 CN disclosed
CN-114846032-B Radical polymerizable resin composition and cured product thereof 株式会社力森诺科 2024-06-18 CN disclosed
CN-117813332-A Resin composition, method for producing same, and composite material 株式会社力森诺科 2024-04-02 CN disclosed
EP-4328206-A1 RECESS FILLING MATERIAL KIT, CURED PRODUCT OF SAME, AND RECESS FILLING METHOD Resonac Corporation (JP) 2024-02-28 EP disclosed
CN-110799558-B Radical polymerizable resin composition and structural repair material 株式会社力森诺科 2024-02-20 CN disclosed
CN-117136175-A Recess filling material kit, cured product thereof, and recess filling method 株式会社力森诺科 2023-11-28 CN disclosed
CN-107428855-B Radically polymerizable resin composition, method for curing same, method for producing same, use of radically polymerizable resin composition, and method for using same 昭和电工株式会社 2019-03-15 CN disclosed
EP-3228637-B1 RADICAL-POLYMERIZABLE RESIN COMPOSITION, CURING METHOD THEREOF, METHOD OF PRODUCING SAME, USE OF RADICAL-POLYMERIZABLE RESIN COMPOSITION, AND USE METHOD OF THEREOF SHOWA DENKO KK (JP) 2019-02-20 EP disclosed
CN-109071777-A Carbon fiber-reinforced resin composition, carbon fiber-reinforced resin composition, solidfied material 昭和电工株式会社 2018-12-21 CN disclosed
US-9969836-B2 Radical-polymerizable resin composition, curing method thereof, method of producing same, use of radical-polymerizable resin composition, and use method of thereof SHOWA DENKO K.K. (JP) 2018-05-15 US disclosed
US-20180009926-A1 RADICAL-POLYMERIZABLE RESIN COMPOSITION, CURING METHOD THEREOF, METHOD OF PRODUCING SAME, USE OF RADICAL-POLYMERIZABLE RESIN COMPOSITION, AND USE METHOD OF THEREOF SHOWA DENKO K.K. (JP) 2018-01-11 US disclosed
CN-107531813-A The manufacture method of free-radical polymerised aqueous resin compositions, its curing and free-radical polymerised aqueous resin compositions 昭和电工株式会社 2018-01-02 CN disclosed
CN-107428855-A Radically polymerizable resin composition, method for curing same, method for producing same, use of radically polymerizable resin composition, and method for using same 昭和电工株式会社 2017-12-01 CN disclosed
EP-3228637-A1 RADICAL-POLYMERIZABLE RESIN COMPOSITION, CURING METHOD THEREOF, METHOD OF PRODUCING SAME, USE OF RADICAL-POLYMERIZABLE RESIN COMPOSITION, AND USE METHOD OF THEREOF Showa Denko K.K. (JP) 2017-10-11 EP disclosed
CN-105008483-A Sheet-adhesive resin composition, laminate, protective sheet for solar cell, and module for solar cell TOYO INK SC HOLDINGS CO LTD 2015-10-28 CN disclosed
US-20040001961-A1 Curable resin composition useful for coating, multi-layer printed wiring board, printed wiring board and dry film TAMURA KAKEN CORPORATION (JP) 2004-01-01 US disclosed