SCHEMBL6544822

SCHEMBL6544822

FC(F)(F)[Si](F)(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28484490 0.71
SCHEMBL8161134 0.67
SCHEMBL20531241 0.67
SCHEMBL15091890 0.67
SCHEMBL1052909 0.62
SCHEMBL10337117 0.62
SCHEMBL31302755 0.61
SCHEMBL4525392 0.59
SCHEMBL703540 0.59
SCHEMBL11796094 0.59

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111302968-B Synthesis method of amide nitrogen trifluoromethyl compound 中国科学院上海有机化学研究所 2021-06-08 CN claimed
CN-109972165-B Electrochemical preparation method of β -trifluoromethyl amide compound 五邑大学 2020-07-17 CN claimed
CN-111302968-A Synthesis method of amide nitrogen trifluoromethyl compound 中国科学院上海有机化学研究所 2020-06-19 CN claimed
CN-101601103-A Gaseous Dielectrics with Low Global Warming Potential HONEYWELL INT INC (US) 2009-12-09 CN claimed
WO-2025121309-A1 ETCHING METHOD 株式会社レゾナック 2025-06-12 WO disclosed
WO-2024258914-A1 PRECURSORS FOR LOW DIELECTRIC FILM DEPOSITION LAM RESEARCH CORPORATION (US) 2024-12-19 WO disclosed
CN-117821020-B Composite cooling medium composition and preparation method and application thereof 润威新材料科技(上海)有限公司 2024-08-16 CN disclosed
CN-118356992-A Inertial microfluidic chip, system and method for cell sorting 南方科技大学 2024-07-19 CN disclosed
CN-117821020-A Composite cooling medium composition and preparation method and application thereof 润威新材料科技(上海)有限公司 2024-04-05 CN disclosed
US-11220584-B2 Protective coating system for plastic substrate PPG INDUSTRIES OHIO, INC. (US) 2022-01-11 US disclosed
CN-111302968-B Synthesis method of amide nitrogen trifluoromethyl compound 中国科学院上海有机化学研究所 2021-06-08 CN disclosed
US-20200299535-A1 PROTECTIVE COATING SYSTEM FOR PLASTIC SUBSTRATE PPG INDUSTRIES OHIO, INC. 2020-09-24 US disclosed
US-6541842-B2 Metal barrier behavior by SiC:H deposition on porous materials DOW CORNING CORPORATION 2003-04-01 US disclosed
WO-2003005438-A2 IMPROVED METAL BARRIER BEHAVIOR BY SIC:H DEPOSITION ON POROUS MATERIALS DOW CORNING CORPORATION (US) 2003-01-16 WO disclosed
US-20030001282-A1 METAL BARRIER BEHAVIOR BY SIC:H DEPOSITION ON POROUS MATERIALS DOW CORNING CORPORATION 2003-01-02 US disclosed
US-20020173172-A1 Method for producing hydrogenated silicon oxycarbide films having low dielectric constant DOW CORNING CORPORATION 2002-11-21 US disclosed
WO-2002077320-A1 METHOD FOR PRODUCING HYDROGENATED SILICON OXYCARBIDE FILMS DOW CORNING CORPORATION (US) 2002-10-03 WO disclosed
US-6458718-B1 PROVIDING A SUBSTRATE; PROVIDING A CHEMICAL PRECURSOR OF THE FORMULA (F3C)4-M-NMXMRN, WHEREIN M IS SILICON OR GERMENIUM, X IS HALOGEN, R IS HYDROGEN OR D, ACTIVATING THE PRECURSOR TO DEPOSIT A FLUORINE CONTAINING MATERIAL ONTO THE SUBSTRATE ASM JAPAN K.K. (JP) 2002-10-01 US disclosed
US-20020045359-A1 Fluorine-containing materials and processes ASM JAPAN K.K. (JP) 2002-04-18 US disclosed
EP-1150345-A2 Fluorine-containing materials and processes ASM JAPAN K.K. (JP) 2001-10-31 EP disclosed