SCHEMBL65511

SCHEMBL65511

Nc1ncnc(N)n1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9562215 0.96 HSP90AA1 (0.50)
Water SCHEMBL6396886 0.96 HSP90AA1 (0.50)
Hydrochloric Acid SCHEMBL15477068 0.96
Benzene SCHEMBL29138620 0.93 BCL6 (0.52)
Ethylenediamine SCHEMBL28690826 0.87 HSP90AA1 (0.43)
Boric Acid SCHEMBL8843768 0.87 HSP90AA1 (0.43)
Methane SCHEMBL11577627 0.81 HSP90AA1 (0.38)
Biphenyl SCHEMBL27987857 0.81 ADORA2A (0.56)
Aniline SCHEMBL28021586 0.81 TSHR (0.55)
SCHEMBL28223585 0.81 HSP90AA1 (0.38)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 9095 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116285204-B Low emission polyoxymethylene compositions TICONA LLC (US) 2026-05-26 CN claimed
CN-122029211-A Thermosetting epoxy resin composition suitable for pre-curing process without additional metal bonding technique SIKA技术股份公司 2026-05-12 CN claimed
EP-3940747-B1 NOVEL ETCHING PATTERN FORMING METHOD IN SEMICONDUCTOR MANUFACTURING PROCESS YOUNG CHANG CHEMICAL CO LTD (KR) 2026-05-06 EP claimed
US-12597566-B2 Multilayer electronic component SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2026-04-07 US claimed
EP-4714998-A1 POLYAMIC ACID COMPOSITION WITH IMPROVED ADHESION AND POLYIMIDE CURED PRODUCT COMPRISING THE SAME PI Advanced Materials Co., Ltd. (KR) 2026-03-25 EP claimed
US-20260062517-A1 POLYAMIC ACID COMPOSITION WITH IMPROVED ADHESION AND POLYIMIDE CURED PRODUCT COMPRISING THE SAME PI ADVANCED MAT CO LTD (KR) 2026-03-05 US claimed
US-12541157-B2 Electrophotographic photosensitive member, process cartridge, electrophotographic apparatus, and method of producing electrophotographic photosensitive member CANON KABUSHIKI KAISHA (JP) 2026-02-03 US claimed
EP-3898857-B2 COMPOSITION FOR APPLYING A MULTILAYER COATING ON A SUBSTRATE ACTEGA RHENANIA GMBH (DE) 2026-01-14 EP claimed
EP-4664197-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-12-17 EP claimed
US-20250368782-A1 POLYIMIDE VARNISH WITH IMPROVED ADHESION AND POLYIMIDE FILM COMPRISING THE SAME PI ADVANCED MAT CO LTD (KR) 2025-12-04 US claimed
EP-0012717-A1 Method and composition for the selective pre-emergent control of weeds in cereal cultures CIBA-GEIGY AG (CH) 1980-06-25 EP claimed
US-4192922-A Finely divided expandable styrene polymers HOECHST AKTIENGESELLSCHAFT (DE) 1980-03-11 US claimed
US-4192933-A Non-pulverulent solid polymeric structure WESTINGHOUSE ELECTRIC CORP. (US) 1980-03-11 US claimed
US-4182695-A Polyamide-fixed biologically active protein BOEHRINGER MANNHEIM GMBH (DE) 1980-01-08 US claimed
US-4163835-A Preparation of electrolyte-free aminoplast resins CASSELLA AKTIENGESELLSCHAFT (DE) 1979-08-07 US claimed
US-4152201-A SIZING ROHM AND HAAS COMPANY (US) 1979-05-01 US claimed
US-4017440-A Polymers stabilized with polymerizable vinylbenzyltrialkyl ammonium salt surfactant ROHM AND HAAS COMPANY (US) 1977-04-12 US claimed
US-3992338-A PACKAGES E. I. DU PONT DE NEMOURS & COMPANY (US) 1976-11-16 US claimed
US-3965058-A AMINE-ALDEHYDE THERMOSETTING RESIN PPG INDUSTRIES, INC. (US) 1976-06-22 US claimed
US-3947396-A Coacervation of anion-containing aqueous disperse systems with amphoteric polyelectrolytes THE DOW CHEMICAL COMPANY (US) 1976-03-30 US claimed