SCHEMBL6564410

SCHEMBL6564410

C=C[Si](C=C)(C=C)OCC(C)C

nearest known ligand 0.38

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL136666 0.79 TSHR (0.38) TSHR
SCHEMBL3020290 0.79 TSHR (0.38) TSHR
SCHEMBL3321575 0.77 TSHR (0.37) TSHR
SCHEMBL5833757 0.77 TSHR (0.37) TSHR
SCHEMBL28497549 0.75 TSHR (0.35) TSHR
SCHEMBL28490561 0.75 TSHR (0.35) TSHR
SCHEMBL5834360 0.75 TSHR (0.35) TSHR
SCHEMBL5834044 0.73 TSHR (0.34) TSHR
SCHEMBL5833755 0.73 TSHR (0.39) TSHR
SCHEMBL5834771 0.72 TSHR (0.33) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed