SCHEMBL6569397

SCHEMBL6569397

[AlH3].[Cu].[MgH2].[Mn].[SiH4]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2773809 0.89
SCHEMBL9404607 0.89
SCHEMBL28876366 0.89
SCHEMBL9838943 0.89
SCHEMBL6535536 0.89
SCHEMBL6546104 0.89
SCHEMBL28942273 0.89
SCHEMBL472970 0.80
SCHEMBL10643789 0.80
SCHEMBL22441988 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3670689-B1 HEAT-RESISTANT ALUMINIUM ALLOY ALUMINIUM RHEINFELDEN ALLOYS GMBH (DE) 2023-10-18 EP claimed
US-9896747-B2 Aluminum alloy with low density and high heat resistance HYUNDAI MOTOR COMPANY (KR) 2018-02-20 US disclosed
US-20150144227-A1 ALUMINUM ALLOY WITH LOW DENSITY AND HIGH HEAT RESISTANCE HYUNDAI MOTOR COMPANY (KR) 2015-05-28 US disclosed
EP-0803766-B1 Photothermographic material FUJI PHOTO FILM CO LTD (JP) 2004-04-07 EP disclosed
US-6203972-B1 DIMENSIONAL STABILITY AND PRODUCES ULTRAHIGH CONTRAST IMAGES; USED FOR MANUFACTURE OF PRINTING PLATES FUJI PHOTO FILM CO., LTD. (JP) 2001-03-20 US disclosed
EP-0803766-A1 Photothermographic material FUJI PHOTO FILM CO., LTD. (JP) 1997-10-29 EP disclosed