SCHEMBL65921

SCHEMBL65921

CN(CCOC(=O)C(C)(C)C)CCOC(=O)C(C)(C)C

nearest known ligand 0.41

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
POLB P06746 2/20 0.41
GAA P10253 1/20 0.41
NPSR1 Q6W5P4 1/20 0.41
CHRM2 P08172 8/20 0.40
CHRM1 P11229 5/20 0.40
CHRM3 P20309 5/20 0.40
CHRM4 P08173 3/20 0.40
CHRM5 P08912 2/20 0.40
CHRNB2 P17787 1/20 0.40
CHRNA4 P43681 1/20 0.40
PRKCA P17252 1/20 0.38
DNM1 Q05193 1/20 0.36
BCHE P06276 3/20 0.36
MEN1 O00255 2/20 0.35
KMT2A Q03164 2/20 0.35
SMN1; SMN2 Q16637 1/20 0.34
ALDH1A1 P00352 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15223078 0.90 NPSR1 (0.36) POLBGAANPSR1CHRM2CHRM1
SCHEMBL16316499 0.89 CHRM2 (0.36) POLBGAANPSR1CHRM2CHRM1
SCHEMBL19628206 0.88 POLB (0.37) POLBGAANPSR1CHRM2CHRM1
SCHEMBL12120221 0.86 CHRM2 (0.56) POLBGAANPSR1CHRM2CHRM1
SCHEMBL65194 0.84 CHRM2 (0.46) POLBGAANPSR1CHRM2CHRM1
SCHEMBL23477580 0.83 KDM4E (0.41) POLBGAANPSR1CHRM2CHRM1
SCHEMBL19832446 0.83 POLB (0.39) POLBGAANPSR1CHRM2CHRM1
SCHEMBL14108286 0.83 CHRM2 (0.38) POLBCHRM2CHRM1CHRM3CHRM4
SCHEMBL13166780 0.80 POLB (0.40) POLBGAANPSR1CHRM2CHRM1
SCHEMBL28740155 0.80 CHRM2 (0.39) POLBNPSR1CHRM2CHRM1CHRM3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 664 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-03-24 US disclosed
EP-4660703-A2 METAL-CONTAINING FILM PATTERNING PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2025-12-10 EP disclosed
US-20250372377-A1 METAL-CONTAINING FILM PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-12-04 US disclosed
US-20250251665-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-08-07 US disclosed
EP-4553100-A1 POLYMER, POSITIVE AND NEGATIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-05-14 EP disclosed
CN-119955091-A Polymer, positive-type negative-type photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, surface protective film, and electronic component 信越化学工业株式会社 2025-05-09 CN disclosed
US-20250147420-A1 Polymer, Positive And Negative Photosensitive Resin Compositions, Patterning Process, Method For Forming Cured Film, Interlayer Insulating Film, Surface Protective Film, And Electronic Component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-05-08 US disclosed
US-12055853-B2 Photosensitive resin composition, laminate, and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-08-06 US disclosed
US-12032287-B2 Resist material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-07-09 US disclosed
CN-115044040-B Polyimide-containing polymer, positive photosensitive resin composition, negative photosensitive resin composition, and pattern forming method 信越化学工业株式会社 2024-07-02 CN disclosed
US-20010051316-A1 Polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-12-13 US disclosed
US-20010044071-A1 Novel ester compounds, polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD (JP) 2001-11-22 US disclosed
EP-1150166-A1 Polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-31 EP disclosed
EP-1150167-A1 Polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-31 EP disclosed
EP-1149825-A2 Ester compounds, polymers, resist compositions and patterning process Shin-Etsu Chemical Co., Ltd. (JP) 2001-10-31 EP disclosed
EP-1148044-A1 Ester compounds, polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-24 EP disclosed
EP-1148045-A1 Ester compounds, polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-24 EP disclosed
US-20010031424-A1 Polymer, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. OF (JP) 2001-10-18 US disclosed
US-20010026904-A1 Polymer, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-04 US disclosed
EP-1132774-A2 Polymer, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-09-12 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component PRDM9, ARCN1, PUF60 POLB 2221/4885GAA 3665/4885NPSR1 4495/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.