SCHEMBL664450

SCHEMBL664450

CCO[Si](OCC)(OCC)C(CCN)[Si](OCC)(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14343802 0.88
SCHEMBL483480 0.82
SCHEMBL28433048 0.81
SCHEMBL315209 0.81
SCHEMBL23282510 0.80 GABRR1 (0.30)
SCHEMBL3231925 0.80 GABRR1 (0.30)
SCHEMBL28138041 0.80
Hydrochloric Acid SCHEMBL29659848 0.78
SCHEMBL28228887 0.78
SCHEMBL23282540 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 125 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116082969-B Low-temperature synergistic co-extrusion white packaging adhesive film and preparation process thereof 浙江祥邦科技股份有限公司 2024-10-18 CN claimed
CN-116082969-A Low-temperature synergistic co-extrusion white packaging adhesive film and preparation process thereof 浙江祥邦科技股份有限公司 2023-05-09 CN claimed
CN-113322013-B Co-extrusion synergistic transparent adhesive film and preparation method thereof 浙江祥邦科技股份有限公司 2022-10-04 CN claimed
CN-111394016-B Silane crosslinking type POE adhesive film and preparation method and application thereof 阿特斯阳光电力集团股份有限公司 2021-07-02 CN claimed
US-20180201816-A1 ADHESIVE COMPOSITION FOR PHOTOCURABLE INTERFACE AND SURFACE MODIFICATION METHOD OF SUBSTRATE USING THE SAME CHEM OPTICS INC. (KR) 2018-07-19 US claimed
US-12584012-B2 Inorganic filler dispersion stabilizer, inorganic filler-containing resin composition, molded article, and additive DIC CORPORATION (JP) 2026-03-24 US disclosed
US-20260049229-A1 STRUCTURE CLADDING STRUCTURE, COATING COMPOSITION, AND METHOD FOR MANUFACTURING SAME KEIWA INCORPORATED (JP) 2026-02-19 US disclosed
US-12503570-B2 Inorganic filler fluidity modifier, inorganic filler-containing resin composition and molded article of resin composition DIC CORPORATION (JP) 2025-12-23 US disclosed
EP-3858941-B1 FLUIDITY MODIFIER, COMPOSITION CONTAINING SAME, AND CURED PRODUCT OF SAID COMPOSITION DAINIPPON INK & CHEMICALS (JP) 2025-10-15 EP disclosed
US-20250250409-A1 MODIFIER FOR FLUIDITY OF INORGANIC FILLER, COMPOSITION CONTAINING INORGANIC FILLER, AND HEAT-CONDUCTIVE SILICONE SHEET DIC CORPORATION (JP) 2025-08-07 US disclosed
EP-4512843-A1 MODIFIER FOR FLUIDITY OF INORGANIC FILLER, COMPOSITION CONTAINING INORGANIC FILLER, AND HEAT-CONDUCTIVE SILICONE SHEET DIC Corporation (JP) 2025-02-26 EP disclosed
CN-119486874-A Structure coating structure, coating composition, and method for producing same 惠和株式会社 2025-02-18 CN disclosed
WO-2008005504-A2 PROCESS FOR PREPARING EROSION RESISTANT FOUNDRY SHAPES WITH AN EPOXY-ACRYLATE COLD-BOX BINDER ASHLAND LICENSING AND INTELLECTUAL PROPERTY LLC (US) 2008-01-10 WO disclosed
EP-1874980-A1 PROCESS FOR FORMING A WELL VISIBLE NON-CHROMATE CONVERSION COATING FOR MAGNESIUM AND MAGNESIUM ALLOYS Chemetall GmbH (DE) 2008-01-09 EP disclosed
EP-1788059-A1 ADHESIVE COMPOSITIONS FOR OPTICAL FIBERS THE YOKOHAMA RUBBER CO., LTD. (JP) 2007-05-23 EP disclosed
EP-1788060-A1 ADHESIVE COMPOSITION THE YOKOHAMA RUBBER CO., LTD. (JP) 2007-05-23 EP disclosed
WO-2007002328-A1 PROTECTIVE COATING FOR WINDOW GLASS DOW GLOBAL TECHNOLOGIES INC. (US) 2007-01-04 WO disclosed
US-20060287408-A1 Protective coating for window glass DOW GLOBAL TECHNOLOGIES LLC 2006-12-21 US disclosed
WO-2006108655-A1 PROCESS FOR FORMING A WELL VISIBLE NON-CHROMATE CONVERSION COATING FOR MAGNESIUM AND MAGNESIUM ALLOYS CHEMETALL GMBH (DE) 2006-10-19 WO disclosed
US-20060234072-A1 Process for forming a well visible non-chromate conversion coating for magnesium and magnesium alloys CHEMETALL GMBH (DE) 2006-10-19 US disclosed