⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27937187 | 1.00 | — | — | |
| SCHEMBL2679973 | 1.00 | — | — | |
| SCHEMBL69601 | 1.00 | — | — | |
| SCHEMBL14151427 | 1.00 | — | — | |
| SCHEMBL7621984 | 1.00 | — | — | |
| SCHEMBL16274558 | 1.00 | — | — | |
| SCHEMBL566504 | 0.82 | — | — | |
| SCHEMBL5387590 | 0.82 | — | — | |
| SCHEMBL11153702 | 0.82 | — | — | |
| SCHEMBL11811115 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 799 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119993931-A | High-efficiency heat-dissipation high-power radio frequency chip multilayer stacking structure and preparation method | 四川中久高装科技有限公司 | 2025-05-13 | — | — | CN | claimed |
| CN-222826414-U | Power device chip interconnection structure and power device | 上海海姆希科半导体有限公司 | 2025-05-02 | — | — | CN | claimed |
| CN-119913441-A | Step-structure copper-molybdenum-copper composite material and preparation method thereof | 长沙升华微电子材料有限公司 | 2025-05-02 | — | — | CN | claimed |
| CN-119725263-A | Copper-molybdenum copper-copper composite material with core material with holes and preparation method thereof | 成都虹波实业股份有限公司 | 2025-03-28 | — | — | CN | claimed |
| CN-119489252-A | Preparation method of copper-molybdenum copper-copper multilayer composite heat sink material | 苏州瑞为沐芯集成电路科技有限公司 | 2025-02-21 | — | — | CN | claimed |
| CN-119210480-A | S-band phased array radio frequency front end transmitting assembly | 四川九洲电器集团有限责任公司 | 2024-12-27 | — | — | CN | claimed |
| CN-221960959-U | High-power-density hybrid integrated isolating switch module packaging structure | 中国振华集团永光电子有限公司（国营第八七三厂） | 2024-11-05 | — | — | CN | claimed |
| CN-118773690-A | Nickel plating method for copper-molybdenum-copper layered composite material | 西安赛尔电子材料科技有限公司 | 2024-10-15 | — | — | CN | claimed |
| CN-118482597-A | Ultrathin heat pipe based on ordered stacked porous medium and preparation method thereof | 南京理工大学 | 2024-08-13 | — | — | CN | claimed |
| CN-118472081-A | Flexible gallium arsenide solar cell without grid line and preparation method thereof | 长三角物理研究中心有限公司 | 2024-08-09 | — | — | CN | claimed |
| US-6060795-A | Semiconductor power pack | INTERSIL CORPORATION (US) | 2000-05-09 | — | — | US | claimed |
| WO-2000003435-A2 | A CAPSULE FOR SEMICONDUCTOR COMPONENTS | TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) (SE) | 2000-01-20 | — | — | WO | claimed |
| CN-1240566-A | Apparatus and method for mounting electronic device | ERICSSON TELEFON AB L M (SE) | 2000-01-05 | — | — | CN | claimed |
| EP-0956746-A1 | MEANS AND METHOD FOR MOUNTING ELECTRONICS | TELEFONAKTIEBOLAGET L M ERICSSON (publ) (SE) | 1999-11-17 | — | — | EP | claimed |
| US-5920461-A | Surface mount power supply device | LAMBDA ELECTRONICS, INC. (US) | 1999-07-06 | — | — | US | claimed |
| EP-0877423-A2 | Integrated circuit package | THE WHITAKER CORPORATION (US) | 1998-11-11 | — | — | EP | claimed |
| WO-1998041071-A1 | HYBRID MODULE ASSEMBLING METHOD AND APPARATUS | XEMOD, INC. (US) | 1998-09-17 | — | — | WO | claimed |
| US-5783857-A | Integrated circuit package | THE WHITAKER CORPORATION (US) | 1998-07-21 | — | — | US | claimed |
| WO-1998018302-A1 | MEANS AND METHOD FOR MOUNTING ELECTRONICS | TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) (SE) | 1998-04-30 | — | — | WO | claimed |
| US-5200640-A | Hermetic package having covers and a base providing for direct electrical connection | ELECTRON POWER INC. (US) | 1993-04-06 | — | — | US | claimed |