SCHEMBL6668050

SCHEMBL6668050

FC(F)C(F)C[SiH](Cl)Cl

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1053319 0.72
SCHEMBL1955727 0.69
SCHEMBL28886918 0.67
SCHEMBL1258387 0.63
SCHEMBL1472170 0.61
SCHEMBL1992270 0.60
SCHEMBL384408 0.60
SCHEMBL524074 0.57
SCHEMBL9229167 0.57
SCHEMBL15403194 0.57

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116034127-B Silicon-containing monomer mixture, polysiloxane, resin composition, photosensitive resin composition, cured film, method for producing cured film, pattern cured film, and method for producing pattern cured film 中央硝子株式会社 2024-03-01 CN disclosed
CN-116601244-A Coating liquid for optical member, polymer, cured film, photosensitive coating liquid, pattern cured film, optical member, solid-state imaging element, display device, silicone compound, stabilizer used in coating liquid, method for producing cured film, method for producing pattern cured film, and method for producing polymer 中央硝子株式会社 2023-08-15 CN disclosed
CN-116601210-A Resin composition, cured film, method for producing cured film, substrate with multilayer film, method for producing substrate with pattern, photosensitive resin composition, method for producing pattern cured film, method for producing polymer, and method for producing resin composition 中央硝子株式会社 2023-08-15 CN disclosed
CN-116265033-A Long-acting anticoagulation coating and plasma preparation method and application thereof 中国科学院深圳先进技术研究院 2023-06-20 CN disclosed
CN-116034127-A Silicon-containing monomer mixture, polysiloxane, resin composition, photosensitive resin composition, cured film, method for producing cured film, pattern cured film, and method for producing pattern cured film 中央硝子株式会社 2023-04-28 CN disclosed
CN-115244465-A Negative photosensitive resin composition, pattern structure, and method for producing pattern cured film 中央硝子株式会社 2022-10-25 CN disclosed
CN-112625243-A Fluorine-containing modified polysiloxane, preparation method and application thereof 山东东岳高分子材料有限公司 2021-04-09 CN disclosed
EP-0969007-B1 Method of making an aromatic chlorosilane compound by a hydrosilation reaction DOW CORNING ASIA LTD (JP) 2004-09-22 EP disclosed
US-6699956-B2 ORGANOPOLYSILOXANE CONTAINING A CYANOALKYL GROUP AND A MONOVALENT HYDROCARBON GROUP HAVING AN ALIPHATIC UNSATURATED BOND, ORGANOHYDROGENPOLYSILOXANE CONTAINING A CYANOALKYL GROUP, PLATINUM GROUP METAL CATALYST SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-03-02 US disclosed
US-20020198319-A1 Highly dielectric addition type curable compositions SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-12-26 US disclosed
US-6054602-A Method of making an aromatic chlorosilane compound by a hydrosilation reaction DOW CORNING ASIA, LTD. (JP) 2000-04-25 US disclosed
US-6022814-A COATING A POLYSILOXANE/SILSESQUIOXANE ON THE SUBSTRATE; HEATING TO A TEMPERATURE RANGING FROM 250.DEGREE. C. TO THE GLASS TRANSITION POINT OF THE POLYMER; DIELECTRIC FILM OF LOW DENSITY AND A LARGE FREE VOLUME; HEAT RESISTANCE KABUSHIKI KAISHA TOSHIBA (JP) 2000-02-08 US disclosed
EP-0969007-A2 Method of making an aromatic chlorosilane compound by a hydrosilation reaction Dow Corning Asia, Ltd. (JP) 2000-01-05 EP disclosed