SCHEMBL669040

SCHEMBL669040

O=S(=O)(O)c1c(O)c(O)cc(O)c1O

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ING2 Q9H160 1/20 0.39
DAPK1 P53355 2/20 0.37
ALDH1A1 P00352 5/20 0.37
HSD17B10 Q99714 5/20 0.37
FABP3 P05413 1/20 0.37
FABP4 P15090 1/20 0.37
FABP5 Q01469 1/20 0.37
CYP2D6 P10635 1/20 0.36
KDM4E B2RXH2 3/20 0.35
HPGD P15428 3/20 0.35
TDP1 Q9NUW8 3/20 0.35
MAPT P10636 2/20 0.35
MAPK1 P28482 2/20 0.35
MEN1 O00255 1/20 0.35
TTR P02766 1/20 0.35
CYP1A1 P04798 1/20 0.35
CYP3A4 P08684 1/20 0.35
HSPD1 P10809 1/20 0.35
ALOX15 P16050 1/20 0.35
ALOX12 P18054 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28020177 0.90 ING2 (0.37) ING2DAPK1ALDH1A1HSD17B10FABP3
SCHEMBL7091094 0.85 HSD17B10 (0.40) ING2DAPK1ALDH1A1HSD17B10FABP3
SCHEMBL29412224 0.85 HSD17B10 (0.40) ING2DAPK1ALDH1A1HSD17B10FABP3
SCHEMBL668351 0.84 ING2 (0.37) ING2DAPK1ALDH1A1HSD17B10FABP3
SCHEMBL19193970 0.84 MAPT (0.47) ING2DAPK1ALDH1A1HSD17B10FABP3
SCHEMBL17005600 0.84 HSD17B10 (0.39) ING2DAPK1ALDH1A1HSD17B10CYP2D6
SCHEMBL19199478 0.84 TTR (0.37) ING2DAPK1ALDH1A1HSD17B10FABP3
SCHEMBL17005598 0.84 HSD17B10 (0.39) ING2DAPK1ALDH1A1HSD17B10FABP3
SCHEMBL7095349 0.83 ING2 (0.39) ING2DAPK1ALDH1A1HSD17B10FABP3
SCHEMBL8746545 0.80 MPL (0.38) ING2ALDH1A1HSD17B10FABP3FABP4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10034387-B2 Method for recycling of obsolete printed circuit boards ENTEGRIS, INC. (US) 2018-07-24 US claimed
US-9731368-B2 Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment ENTEGRIS, INC. (US) 2017-08-15 US claimed
US-9649712-B2 Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment ENTEGRIS, INC. (US) 2017-05-16 US claimed
US-20170079146-A1 METHOD FOR RECYCLING OF OBSOLETE PRINTED CIRCUIT BOARDS ADVANCED TECH MATERIALS (US) 2017-03-16 US claimed
EP-2790845-B1 APPARATUS AND METHOD FOR STRIPPING SOLDER METALS DURING THE RECYCLING OF WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT ENTEGRIS INC (US) 2017-02-08 EP claimed
CN-103402659-B Apparatus and method for stripping solder metal during recycling of discarded electrical and electronic equipment MYKROLIS CORP. (US) 2016-11-30 CN claimed
US-20160122846-A1 SUSTAINABLE PROCESS FOR RECLAIMING PRECIOUS METALS AND BASE METALS FROM E-WASTE ENTEGRIS, INC. 2016-05-05 US claimed
US-20160095230-A1 METHOD FOR RECYCLING OF OBSOLETE PRINTED CIRCUIT BOARDS ENTEGRIS, INC. 2016-03-31 US claimed
US-9221114-B2 Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2015-12-29 US claimed
US-9215813-B2 Method for recycling of obsolete printed circuit boards ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2015-12-15 US claimed
WO-2021131538-A1 CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING PATTERNED RESIST FILM, METHOD FOR PRODUCING SUBSTRATE PROVIDED WITH TEMPLATE, AND METHOD FOR PRODUCING PLATED MODELED OBJECT 東京応化工業株式会社 2021-07-01 WO disclosed
US-10034387-B2 Method for recycling of obsolete printed circuit boards ENTEGRIS, INC. (US) 2018-07-24 US disclosed
US-9731368-B2 Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment ENTEGRIS, INC. (US) 2017-08-15 US disclosed
CN-106944452-A For the apparatus and method for recycling period stripping solder metal in discarded Electrical and Electronic equipment 恩特格里斯公司 2017-07-14 CN disclosed
CN-106914470-A For the apparatus and method for recycling period stripping solder metal in discarded Electrical and Electronic equipment 恩特格里斯公司 2017-07-04 CN disclosed
EP-2558605-A1 METHOD FOR RECYCLING OF OBSOLETE PRINTED CIRCUIT BOARDS Advanced Technology Materials, Inc. (US) 2013-02-20 EP disclosed
WO-2012024603-A2 SUSTAINABLE PROCESS FOR RECLAIMING PRECIOUS METALS AND BASE METALS FROM E-WASTE ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2012-02-23 WO disclosed
WO-2011130622-A1 METHOD FOR RECYCLING OF OBSOLETE PRINTED CIRCUIT BOARDS ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2011-10-20 WO disclosed
US-7247566-B2 CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers DUPONT AIR PRODUCTS NANOMATERIALS LLC (US) 2007-07-24 US disclosed
US-20050090109-A1 CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers VERSUM MATERIALS US, LLC 2005-04-28 US disclosed