SCHEMBL6728251

SCHEMBL6728251

CCCC#CS(=O)(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1109987 0.85 HMGCR (0.39)
SCHEMBL18140497 0.81 PTPN7 (0.48)
SCHEMBL18141661 0.81 PTPN7 (0.48)
SCHEMBL18141348 0.81 PTPN7 (0.48)
SCHEMBL18139924 0.81 PTPN7 (0.48)
SCHEMBL18140754 0.81 PTPN7 (0.48)
SCHEMBL8617504 0.81 PTPN7 (0.48)
SCHEMBL11323896 0.78
SCHEMBL2879940 0.78
SCHEMBL6728245 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0025694-B1 BRIGHT NICKEL PLATING BATH AND PROCESS AND COMPOSITION THEREFOR M & T CHEMICALS, INC. (US) 1984-03-28 EP claimed
US-4435254-A ACETYLENIC AMINES AND SULFONATES M&T CHEMICALS INC. (US) 1984-03-06 US claimed
EP-0025694-A1 Bright nickel plating bath and process and composition therefor M & T CHEMICALS, INC. (US) 1981-03-25 EP claimed
CN-114059125-A Cobalt plating compositions comprising additives for void-free sub-micron structure filling 巴斯夫欧洲公司 2022-02-18 CN disclosed
CN-109477234-B Cobalt plating compositions comprising additives for void-free sub-micron structure filling 巴斯夫欧洲公司 2021-12-10 CN disclosed
EP-3885475-A1 COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SUBMICRON FEATURE FILLING BASF SE (DE) 2021-09-29 EP disclosed
EP-3485069-B1 COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SUBMICRON FEATURE FILLING BASF SE (DE) 2021-04-28 EP disclosed
US-20210040635-A1 COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SUBMICRON FEATURE FILLING BASF SE (DE) 2021-02-11 US disclosed
US-20190226107-A1 COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SUBMICRON FEATURE FILLING BASF SE (DE) 2019-07-25 US disclosed
EP-3485069-A1 COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SUBMICRON FEATURE FILLING BASF SE (DE) 2019-05-22 EP disclosed
CN-109477234-A Cobalt plating compositions comprising additives for void-free sub-micron structure filling 巴斯夫欧洲公司 2019-03-15 CN disclosed
US-6737544-B1 HEATING ABOVE MELTING POINT BASF AKTIENGESELLSCHAFT (DE) 2004-05-18 US disclosed
US-6150303-A Substituted 3-phenylisoxazolines BASF AKTIENGESELLSCHAFT (DE) 2000-11-21 US disclosed
US-4891069-A CATALYST FOR REDUCTION OF METAL COMPOUND BY GENERATED HYDROGEN TECHNO INSTRUMENTS INVESTMENTS 1983 LTD. (IL) 1990-01-02 US disclosed
US-4790912-A ELECTROLYTICALLY-GENERATED HYDROGEN AND CATALYST CONVERT METAL SALT IN BATH TO METAL TECHNO-INSTRUMENTS INVESTMENTS LTD. (IL) 1988-12-13 US disclosed
US-4749449-A PLATING ON CATALYZED THROUGH HOLE WALL IN PATTERENED CONDUCTIVE AND INSULATING LAYERS E. I. DU PONT DE NEMOURS AND COMPANY (US) 1988-06-07 US disclosed
EP-0248683-A2 Composition and process for the electrolytic coating of circuit boards without an electroless metal coating A.P.T. Advanced Plating Technologies (IL) 1987-12-09 EP disclosed
EP-0025694-B1 BRIGHT NICKEL PLATING BATH AND PROCESS AND COMPOSITION THEREFOR M & T CHEMICALS, INC. (US) 1984-03-28 EP disclosed
US-4435254-A ACETYLENIC AMINES AND SULFONATES M&T CHEMICALS INC. (US) 1984-03-06 US disclosed
EP-0025694-A1 Bright nickel plating bath and process and composition therefor M & T CHEMICALS, INC. (US) 1981-03-25 EP disclosed