Formaldehyde

Formaldehyde

SCHEMBL674183

C=O.CCCCCCCCCCc1ccccc1O

nearest known ligand 0.61

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Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
BID P55957 3/20 0.61
MCL1 Q07820 3/20 0.61
BCL2L1 Q07817 2/20 0.61
BAK1 Q16611 2/20 0.61
KAT8 Q9H7Z6 2/20 0.61
SAE1 Q9UBE0 2/20 0.61
PPARG P37231 1/20 0.61
PPARA Q07869 1/20 0.61
EP300 Q09472 1/20 0.61
KAT2A Q92830 1/20 0.61
KAT2B Q92831 1/20 0.61
KAT5 Q92993 1/20 0.61
LIPG Q9Y5X9 1/20 0.58
MAPT P10636 2/20 0.56
ALOX15 P16050 2/20 0.56
TSHR P16473 2/20 0.56
MEN1 O00255 1/20 0.56
TP53 P04637 1/20 0.56
CYP3A4 P08684 1/20 0.56
ALOX5 P09917 1/20 0.56

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Formaldehyde SCHEMBL31635859 1.00 BID (0.61) BIDMCL1BCL2L1BAK1KAT8
Formaldehyde SCHEMBL151610 1.00 BID (0.61) BIDMCL1BCL2L1BAK1KAT8
Formaldehyde SCHEMBL1643161 1.00 BID (0.61) BIDMCL1BCL2L1BAK1KAT8
Formaldehyde SCHEMBL9493741 1.00 BID (0.61) BIDMCL1BCL2L1BAK1KAT8
Formaldehyde SCHEMBL6469668 1.00 BID (0.61) BIDMCL1BCL2L1BAK1KAT8
Formaldehyde SCHEMBL442123 1.00 BID (0.61) BIDMCL1BCL2L1BAK1KAT8
Formaldehyde SCHEMBL9352709 1.00 BID (0.61) BIDMCL1BCL2L1BAK1KAT8
Formaldehyde SCHEMBL9497542 1.00 BID (0.61) BIDMCL1BCL2L1BAK1KAT8
Formaldehyde SCHEMBL269840 1.00 BID (0.61) BIDMCL1BCL2L1BAK1KAT8
Formaldehyde SCHEMBL28898238 1.00 BID (0.61) BIDMCL1BCL2L1BAK1KAT8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109476830-B Hardener composition and associated forming process, uncured and cured epoxy resin composition, and article 沙特基础工业全球技术有限公司 2021-07-09 CN claimed
CN-108290386-B Method of forming a cured epoxy material, cured epoxy material formed thereby, and composite core incorporating the cured epoxy material 沙特基础工业全球技术有限公司 2021-05-14 CN claimed
US-20190241698-A1 HARDENER COMPOSITION AND ASSOCIATED FORMING METHOD, UNCURED AND CURED EPOXY RESIN COMPOSITIONS, AND ARTICLE SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2019-08-08 US claimed
EP-3487906-A1 HARDENER COMPOSITION AND ASSOCIATED FORMING METHOD, UNCURED AND CURED EPOXY RESIN COMPOSITIONS, AND ARTICLE SABIC Global Technologies B.V. (NL) 2019-05-29 EP claimed
CN-109476830-A Hardener composition and relevant manufacturing process, uncured and cured composition epoxy resin and product 沙特基础工业全球技术有限公司 2019-03-15 CN claimed
US-20180319930-A1 METHOD OF FORMING A CURED EPOXY MATERIAL, CURED EPOXY MATERIAL FORMED THEREBY, PHENYLENE ETHER OLIGOMER-ANHYDRIDE REACTION PRODUCT USEFUL IN THE METHOD, AND COMPOSITE CORE INCORPORATING THE CURED EPOXY MATERIAL SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2018-11-08 US claimed
EP-3377315-A1 METHOD OF FORMING A CURED EPOXY MATERIAL, CURED EPOXY MATERIAL FORMED THEREBY, PHENYLENE ETHER OLIGOMER-ANHYDRIDE REACTION PRODUCT USEFUL IN THE METHOD, AND COMPOSITE CORE INCORPORATING THE CURED EPOXY MATERIAL SABIC Global Technologies B.V. (NL) 2018-09-26 EP claimed
CN-108290386-A It forms the method for cured epoxy material, the cured epoxy material formed by it, useful phenylene ether oligomer-anhydride reaction product and combine the composite material core of cured epoxy material in the method 沙特基础工业全球技术有限公司 2018-07-17 CN claimed
WO-2018022262-A1 HARDENER COMPOSITION AND ASSOCIATED FORMING METHOD, UNCURED AND CURED EPOXY RESIN COMPOSITIONS, AND ARTICLE SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2018-02-01 WO claimed
EP-3640275-B1 CURABLE EPOXY COMPOSITIONS AND CURED PRODUCTS THEREOF SHPP GLOBAL TECH BV (NL) 2022-06-29 EP disclosed
US-20220145065-A1 CROSS-LINKABLE NETWORK FROM FUNCTIONALIZED POLYETHERIMIDE AND THERMOSET POLYMER RESULTING THEREFROM SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2022-05-12 US disclosed
EP-3931238-A1 CROSS-LINKABLE NETWORK FROM FUNCTIONALIZED POLYETHERIMIDE AND THERMOSET POLYMER RESULTING THEREFROM SHPP Global Technologies B.V. (NL) 2022-01-05 EP disclosed
CN-109476830-B Hardener composition and associated forming process, uncured and cured epoxy resin composition, and article 沙特基础工业全球技术有限公司 2021-07-09 CN disclosed
WO-2021096654-A1 CURING COMPOSITION FOR HIGH HEAT ADHESIVE EPOXY RESIN SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2021-05-20 WO disclosed
US-20100084170-A1 COMPOSITE-FORMING METHOD, COMPOSITES FORMED THEREBY, AND PRINTED CIRCUIT BOARDS INCORPORATING THEM SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2010-04-08 US disclosed
US-7655278-B2 Composite-forming method, composites formed thereby, and printed circuit boards incorporating them SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2010-02-02 US disclosed
CN-101583686-A Composite-forming method, composites formed thereby, and printed circuit boards incorporating them SABIC INNOVATIVE PLASTICS IP (NL) 2009-11-18 CN disclosed
WO-2008094796-A1 COMPOSITE-FORMING METHOD, COMPOSITES FORMED THEREBY, AND PRINTED CIRCUIT BOARDS INCORPORATING THEM SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2008-08-07 WO disclosed
US-20080178983-A1 COMPOSITE-FORMING METHOD, COMPOSITES FORMED THEREBY, AND PRINTED CIRCUIT BOARDS INCORPORATING THEM SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2008-07-31 US disclosed
WO-2008036454-A1 POLY (ARYLENE ETHER) COPOLYMER SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2008-03-27 WO disclosed