Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | POLB | P06746 | 1/20 | 0.47 |
| ▸ | MGAM | O43451 | 7/20 | 0.44 |
| ▸ | GAA | P10253 | 7/20 | 0.44 |
| ▸ | SI | P14410 | 7/20 | 0.44 |
| ▸ | MGAM2 | Q2M2H8 | 7/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.43 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.43 |
| ▸ | ESR1 | P03372 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6755300 | 0.98 | POLB (0.46) | POLBMGAMGAASIMGAM2 | |
| SCHEMBL6757245 | 0.98 | POLB (0.46) | POLBMGAMGAASIMGAM2 | |
| SCHEMBL6753949 | 0.98 | POLB (0.46) | POLBMGAMGAASIMGAM2 | |
| SCHEMBL6756127 | 0.98 | POLB (0.46) | POLBMGAMGAASIMGAM2 | |
| SCHEMBL6759148 | 0.98 | POLB (0.46) | POLBMGAMGAASIMGAM2 | |
| SCHEMBL6759162 | 0.98 | POLB (0.46) | POLBMGAMGAASIMGAM2 | |
| SCHEMBL6756152 | 0.98 | POLB (0.46) | POLBMGAMGAASIMGAM2 | |
| SCHEMBL6759161 | 0.98 | POLB (0.46) | POLBMGAMGAASIMGAM2 | |
| SCHEMBL6759151 | 0.98 | POLB (0.46) | POLBMGAMGAASIMGAM2 | |
| SCHEMBL6757112 | 0.98 | POLB (0.46) | POLBMGAMGAASIMGAM2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0428260-B1 | Metal surface treatment agents | SANWA LAB LTD (JP) | 2000-01-05 | — | — | EP | claimed |
| EP-0562187-B1 | Process for production of copper through-hole printed wiring boards | SANWA LAB LTD (JP) | 1996-01-10 | — | — | EP | claimed |
| US-5275694-A | Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching | SANWA LABORATORY LTD. (JP) | 1994-01-04 | — | — | US | claimed |
| EP-0562187-A1 | Process for production of copper through-hole printed wiring boards | SANWA LABORATORY LTD. (JP) | 1993-09-29 | — | — | EP | claimed |
| US-5173130-A | Immersing copper or alloy to be soldered in an aqueous solution containing a 2-alkylbenzimidazole and an organic acid to form a corrosion and heat resistant protective coating | SHIKOKU CHEMICALS CORPORATION (JP) | 1992-12-22 | — | — | US | claimed |
| US-6712262-B2 | BENZIMIDAZOLE AND IODINE COMPOUNDS | TAMURAKAKEN CORPORATION (JP) | 2004-03-30 | — | — | US | disclosed |
| US-20030141351-A1 | Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board | TAMURA CORPORATION (JP) | 2003-07-31 | — | — | US | disclosed |
| EP-0428260-B1 | Metal surface treatment agents | SANWA LAB LTD (JP) | 2000-01-05 | — | — | EP | disclosed |
| EP-0562187-B1 | Process for production of copper through-hole printed wiring boards | SANWA LAB LTD (JP) | 1996-01-10 | — | — | EP | disclosed |
| US-5275694-A | Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching | SANWA LABORATORY LTD. (JP) | 1994-01-04 | — | — | US | disclosed |
| EP-0562187-A1 | Process for production of copper through-hole printed wiring boards | SANWA LABORATORY LTD. (JP) | 1993-09-29 | — | — | EP | disclosed |
| US-5173130-A | Immersing copper or alloy to be soldered in an aqueous solution containing a 2-alkylbenzimidazole and an organic acid to form a corrosion and heat resistant protective coating | SHIKOKU CHEMICALS CORPORATION (JP) | 1992-12-22 | — | — | US | disclosed |
| EP-0428383-A1 | Process for surface treatment of copper and copper alloy | SHIKOKU CHEMICALS CORPORATION (JP) | 1991-05-22 | — | — | EP | disclosed |
| EP-0428260-A2 | Metal surface treatment agents | SANWA LABORATORY LTD. (JP) | 1991-05-22 | — | — | EP | disclosed |