Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PARP1 | P09874 | 1/20 | 0.48 |
| ▸ | POLB | P06746 | 1/20 | 0.46 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.45 |
| ▸ | PI4KA | P42356 | 1/20 | 0.43 |
| ▸ | PI4K2B | Q8TCG2 | 1/20 | 0.43 |
| ▸ | PI4K2A | Q9BTU6 | 1/20 | 0.43 |
| ▸ | PI4KB | Q9UBF8 | 1/20 | 0.43 |
| ▸ | GPR84 | Q9NQS5 | 5/20 | 0.42 |
| ▸ | NR2F2 | P24468 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6759150 | 1.00 | PARP1 (0.48) | PARP1POLBKCNH2PI4KAPI4K2B | |
| SCHEMBL6757219 | 1.00 | PARP1 (0.48) | PARP1POLBKCNH2PI4KAPI4K2B | |
| SCHEMBL6753951 | 1.00 | PARP1 (0.48) | PARP1POLBKCNH2PI4KAPI4K2B | |
| SCHEMBL6757114 | 1.00 | PARP1 (0.48) | PARP1POLBKCNH2PI4KAPI4K2B | |
| SCHEMBL6756154 | 1.00 | PARP1 (0.48) | PARP1POLBKCNH2PI4KAPI4K2B | |
| SCHEMBL6756129 | 1.00 | PARP1 (0.48) | PARP1POLBKCNH2PI4KAPI4K2B | |
| SCHEMBL6759164 | 1.00 | PARP1 (0.48) | PARP1POLBKCNH2PI4KAPI4K2B | |
| SCHEMBL6759153 | 1.00 | PARP1 (0.48) | PARP1POLBKCNH2PI4KAPI4K2B | |
| SCHEMBL6755305 | 1.00 | PARP1 (0.48) | PARP1POLBKCNH2PI4KAPI4K2B | |
| SCHEMBL6759163 | 1.00 | PARP1 (0.48) | PARP1POLBKCNH2PI4KAPI4K2B |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0428260-B1 | Metal surface treatment agents | SANWA LAB LTD (JP) | 2000-01-05 | — | — | EP | claimed |
| EP-0562187-B1 | Process for production of copper through-hole printed wiring boards | SANWA LAB LTD (JP) | 1996-01-10 | — | — | EP | claimed |
| US-5275694-A | Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching | SANWA LABORATORY LTD. (JP) | 1994-01-04 | — | — | US | claimed |
| EP-0562187-A1 | Process for production of copper through-hole printed wiring boards | SANWA LABORATORY LTD. (JP) | 1993-09-29 | — | — | EP | claimed |
| EP-0428260-A2 | Metal surface treatment agents | SANWA LABORATORY LTD. (JP) | 1991-05-22 | — | — | EP | claimed |
| US-6712262-B2 | BENZIMIDAZOLE AND IODINE COMPOUNDS | TAMURAKAKEN CORPORATION (JP) | 2004-03-30 | — | — | US | disclosed |
| US-20030141351-A1 | Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board | TAMURA CORPORATION (JP) | 2003-07-31 | — | — | US | disclosed |
| EP-0428260-B1 | Metal surface treatment agents | SANWA LAB LTD (JP) | 2000-01-05 | — | — | EP | disclosed |
| EP-0562187-B1 | Process for production of copper through-hole printed wiring boards | SANWA LAB LTD (JP) | 1996-01-10 | — | — | EP | disclosed |
| US-5275694-A | Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching | SANWA LABORATORY LTD. (JP) | 1994-01-04 | — | — | US | disclosed |
| EP-0562187-A1 | Process for production of copper through-hole printed wiring boards | SANWA LABORATORY LTD. (JP) | 1993-09-29 | — | — | EP | disclosed |
| EP-0428260-A2 | Metal surface treatment agents | SANWA LABORATORY LTD. (JP) | 1991-05-22 | — | — | EP | disclosed |