SCHEMBL6756145

SCHEMBL6756145

CCCCCc1nc2ccc(C)c(C)c2[nH]1

nearest known ligand 0.55

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
PI4KA P42356 1/20 0.44
PI4K2B Q8TCG2 1/20 0.44
PI4K2A Q9BTU6 1/20 0.44
PI4KB Q9UBF8 1/20 0.44
KMT2A Q03164 1/20 0.43
PARP1 P09874 1/20 0.42
GPR84 Q9NQS5 5/20 0.41
POLB P06746 1/20 0.40
MAPT P10636 1/20 0.39
PKM P14618 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6753965 0.98 PI4KA (0.43) PI4KAPI4K2BPI4K2API4KBKMT2A
SCHEMBL6753880 0.98 PI4KA (0.43) PI4KAPI4K2BPI4K2API4KBKMT2A
SCHEMBL6755290 0.98 PI4KA (0.43) PI4KAPI4K2BPI4K2API4KBKMT2A
SCHEMBL6756289 0.98 PI4KA (0.43) PI4KAPI4K2BPI4K2API4KBKMT2A
SCHEMBL6755316 0.98 PI4KA (0.43) PI4KAPI4K2BPI4K2API4KBKMT2A
SCHEMBL6753957 0.98 PI4KA (0.43) PI4KAPI4K2BPI4K2API4KBKMT2A
SCHEMBL6756132 0.98 PI4KA (0.43) PI4KAPI4K2BPI4K2API4KBKMT2A
SCHEMBL6759157 0.98 PI4KA (0.43) PI4KAPI4K2BPI4K2API4KBKMT2A
SCHEMBL6753934 0.98 PI4KA (0.43) PI4KAPI4K2BPI4K2API4KBKMT2A
SCHEMBL6753999 0.98 PI4KA (0.43) PI4KAPI4K2BPI4K2API4KBKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 EP claimed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 EP claimed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 US claimed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 EP claimed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 EP claimed
US-6712262-B2 BENZIMIDAZOLE AND IODINE COMPOUNDS TAMURAKAKEN CORPORATION (JP) 2004-03-30 US disclosed
US-20030141351-A1 Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board TAMURA CORPORATION (JP) 2003-07-31 US disclosed
US-20020067486-A1 Solderability assessment AMERICAN COMPETITIVENESS INSTITUTE 2002-06-06 US disclosed
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 EP disclosed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 EP disclosed
US-5348590-A Surface treating agent for copper or copper alloys HITACHI, LTD. (JP) 1994-09-20 US disclosed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 US disclosed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 EP disclosed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 EP disclosed