SCHEMBL675714

SCHEMBL675714

C=CC[SiH](C)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17521970 0.79
SCHEMBL169293 0.74
SCHEMBL81941 0.73
SCHEMBL7178581 0.73
SCHEMBL2038753 0.72
SCHEMBL674161 0.72
SCHEMBL7866417 0.70
SCHEMBL8075088 0.70
SCHEMBL22654310 0.69
SCHEMBL3265457 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117355632-A Method for producing planarizing film, material for planarizing film, and planarizing film 东曹株式会社 2024-01-05 CN disclosed
EP-1746132-B1 SILICON-CONTAINING CURABLE COMPOSITION AND CURED OBJECT OBTAINED BY THERMALLY CURING THE SAME ADEKA CORP (JP) 2013-07-10 EP disclosed
US-7939614-B2 Silicon-containing curing composition and heat cured product thereof ADEKA CORPORATION (JP) 2011-05-10 US disclosed
US-20070197755-A1 Silicon-containing curing composition and heat cured product thereof ADEKA CORPORATION (JP) 2007-08-23 US disclosed
EP-1746132-A1 SILICON-CONTAINING CURABLE COMPOSITION AND CURED OBJECT OBTAINED BY THERMALLY CURING THE SAME Adeka Corporation (JP) 2007-01-24 EP disclosed