SCHEMBL6757154

SCHEMBL6757154

Cc1cc(C2C=CCC2)cc(C)c1O

nearest known ligand 0.38

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.38
CA2 P00918 1/20 0.38
CYP2C9 P11712 1/20 0.33
ACHE P22303 1/20 0.32
ESR2 Q92731 2/20 0.31
ESR1 P03372 1/20 0.31
ALOX15 P16050 1/20 0.31
RECQL P46063 1/20 0.31
EEF2K O00418 1/20 0.31
SRC P12931 1/20 0.31
HKDC1 Q2TB90 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27991914 0.89 CA1 (0.35) CA1CA2CYP2C9ACHE
SCHEMBL6758132 0.80 TP53 (0.39) CYP2C9ESR2ESR1ALOX15RECQL
SCHEMBL11735281 0.78 BACE1 (0.35) ESR2ALOX15RECQL
SCHEMBL27789729 0.72 NPC1 (0.49) ESR2ESR1
SCHEMBL27991830 0.70 TP53 (0.37) CYP2C9ESR2ESR1ALOX15RECQL
SCHEMBL10834735 0.70 CA1 (0.48) CA1CA2CYP2C9ACHEESR2
SCHEMBL1715789 0.70 CA1 (0.48) CA1CA2CYP2C9ACHEESR2
SCHEMBL6755897 0.69 ESR2 (0.42) CA1CA2CYP2C9ESR2ESR1
Methane SCHEMBL28815359 0.68 SERPINE1 (0.33)
SCHEMBL5789097 0.67 CA1 (0.44) CA1CA2CYP2C9ACHEESR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6713589-B2 GLASS TRANSITION TEMPERATURE, LOW MOISTURE ABSORPTION, ADHESION HITACHI CHEMICAL COMPANY, LTD. (JP) 2004-03-30 US disclosed
US-20020065386-A1 Glass transition temperature, low moisture absorption, adhesion HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-05-30 US disclosed
US-6329492-B1 USEFUL AS MATERIAL FOR ENCAPSULATING ELECTRONIC DEVICES, FOR LAMINATION OR FOR ADHESION; CURING AGENT FOR EPOXY RESINS HITACHI CHEMICAL COMPANY, LTD. (JP) 2001-12-11 US disclosed