SCHEMBL6759152

SCHEMBL6759152

CCCCCCCCCCCCCCCCCc1nc2c(C)cccc2n1C

nearest known ligand 0.55

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TLR7 Q9NYK1 5/20 0.55
TLR8 Q9NR97 6/20 0.55
MAPT P10636 1/20 0.47
KCNH2 Q12809 1/20 0.44
MEN1 O00255 1/20 0.39
ALDH1A1 P00352 1/20 0.39
TSHR P16473 1/20 0.39
RAB9A P51151 1/20 0.39
KMT2A Q03164 1/20 0.39
HSP90AB1 P08238 1/20 0.39
HSD11B1 P28845 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6756287 1.00 TLR7 (0.55) TLR7TLR8MAPTKCNH2MEN1
SCHEMBL6756140 1.00 TLR7 (0.55) TLR7TLR8MAPTKCNH2MEN1
SCHEMBL6753962 1.00 TLR7 (0.55) TLR7TLR8MAPTKCNH2MEN1
SCHEMBL6755313 1.00 TLR7 (0.55) TLR7TLR8MAPTKCNH2MEN1
SCHEMBL6753996 1.00 TLR7 (0.55) TLR7TLR8MAPTKCNH2MEN1
SCHEMBL6753948 1.00 TLR7 (0.55) TLR7TLR8MAPTKCNH2MEN1
SCHEMBL6756282 1.00 TLR7 (0.55) TLR7TLR8MAPTKCNH2MEN1
SCHEMBL6756124 1.00 TLR7 (0.55) TLR7TLR8MAPTKCNH2MEN1
SCHEMBL6753931 1.00 TLR7 (0.55) TLR7TLR8MAPTKCNH2MEN1
SCHEMBL6755285 1.00 TLR7 (0.55) TLR7TLR8MAPTKCNH2MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 EP claimed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 EP claimed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 US claimed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 EP claimed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 EP claimed
US-6712262-B2 BENZIMIDAZOLE AND IODINE COMPOUNDS TAMURAKAKEN CORPORATION (JP) 2004-03-30 US disclosed
US-20030141351-A1 Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board TAMURA CORPORATION (JP) 2003-07-31 US disclosed
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 EP disclosed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 EP disclosed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 US disclosed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 EP disclosed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 EP disclosed