Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPK1 | P28482 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
| ▸ | POLB | P06746 | 1/20 | 0.30 |
| ▸ | TSHR | P16473 | 1/20 | 0.30 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8732172 | 0.79 | MAPK1 (0.32) | MAPK1SMN1; SMN2 | |
| SCHEMBL10397247 | 0.73 | MAPK1 (0.31) | MAPK1SMN1; SMN2 | |
| SCHEMBL16194902 | 0.72 | — | — | |
| SCHEMBL3221425 | 0.63 | MAPK1 (0.40) | MAPK1SMN1; SMN2 | |
| SCHEMBL7940652 | 0.63 | — | — | |
| SCHEMBL633176 | 0.61 | MAPK1 (0.40) | MAPK1SMN1; SMN2TSHRL3MBTL1 | |
| SCHEMBL7198268 | 0.60 | — | — | |
| SCHEMBL168692 | 0.60 | MAPK1 (0.36) | MAPK1SMN1; SMN2 | |
| SCHEMBL8619563 | 0.58 | MAPK1 (0.34) | MAPK1SMN1; SMN2 | |
| SCHEMBL2917939 | 0.57 | TP53 (0.36) | MAPK1SMN1; SMN2TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 96 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119039568-A | Curing agent composition for epoxy resin and epoxy resin composition | 上海华谊树脂有限公司 | 2024-11-29 | — | — | CN | claimed |
| EP-2546275-B1 | Curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic parts, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation. | DAICEL CORP (JP) | 2023-09-20 | — | — | EP | claimed |
| CN-108456501-B | Conductive adhesive composition | 株式会社东进世美肯 | 2022-05-27 | — | — | CN | claimed |
| CN-114479014-A | PMMA photodiffusion type epoxy curing agent and preparation method thereof | 广州惠利电子材料有限公司 | 2022-05-13 | — | — | CN | claimed |
| EP-2546275-A2 | Curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic parts, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation. | Daicel Chemical Industries, Ltd. (JP) | 2013-01-16 | — | — | EP | claimed |
| US-7781543-B2 | Curable alicyclic diepoxy resin composition | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2010-08-24 | — | — | US | claimed |
| US-20090131547-A1 | Process for preparation of alicyclic diepoxy compounds, curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic parts, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation | MAESHIMA HISASHI | 2009-05-21 | — | — | US | claimed |
| US-20060009547-A1 | Process for preparation of alicyclic diepoxy compound, curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic components, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2006-01-12 | — | — | US | claimed |
| EP-1541567-A1 | PROCESS FOR PREPARATION OF ALICYCLIC DIEPOXY COMPOUNDS, CURABLE EPOXY RESIN COMPOSITIONS, EPOXY RESIN COMPOSITIONS FOR THE ENCAPSULATION OF ELECTRONIC COMPONENTS, STABILIZERS FOR ELECTRICAL INSULATING OILS, AND CASTING EPOXY RESIN COMPOSITIONS FOR ELECTRICAL INSULATION | DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) | 2005-06-15 | — | — | EP | claimed |
| JP-6016785-A | — | — | None | — | — | JP | disclosed |
| JP-6073043-A | — | — | None | — | — | JP | disclosed |
| JP-4009376-A | — | — | None | — | — | JP | disclosed |
| JP-5059153-A | — | — | None | — | — | JP | disclosed |
| CN-116209683-B | Method for delivering non-aromatic solutions to a polymerization reactor | 埃克森美孚化学专利公司 | 2025-05-13 | — | — | CN | disclosed |
| US-5149831-A | Isomerizing 5-methylcycopentadiene to 1-and 2-; Diels-Alder reaction with maleic anhydride | TONEN CORPORATION (JP) | 1992-09-22 | — | — | US | disclosed |
| JP-H049376-A | PRODUCTION OF METHYLNORBORNENE DICARBOXYLIC ACID ANHYDRIDE | TONEN CORP | 1992-01-14 | — | — | JP | disclosed |
| EP-0455416-A3 | PROCESS FOR PRODUCING METHYLNORBORNENE DICARBOXYLIC ACID ANHYDRIDE | Tonen Corporation (JP) | 1991-11-21 | — | — | EP | disclosed |
| EP-0455416-A2 | Process for producing methylnorbornene dicarboxylic acid anhydride | Tonen Corporation (JP) | 1991-11-06 | — | — | EP | disclosed |
| EP-0455416-A2 | Process for producing methylnorbornene dicarboxylic acid anhydride | Tonen Corporation (JP) | 1991-11-06 | — | — | EP | disclosed |
| EP-0455416-A2 | Process for producing methylnorbornene dicarboxylic acid anhydride | Tonen Corporation (JP) | 1991-11-06 | — | — | EP | disclosed |