SCHEMBL677442

SCHEMBL677442

CCC(C)(C)CC(C)(C)Cl

nearest known ligand 0.35

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.35
TDP1 Q9NUW8 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL43270 0.82 TSHR (0.39) TSHR
SCHEMBL10794688 0.78 TSHR (0.46) TSHRTDP1
SCHEMBL18697049 0.76 TSHR (0.38) TSHRTDP1
SCHEMBL331880 0.73
SCHEMBL4666457 0.73
SCHEMBL6917772 0.73 TSHR (0.35) TSHRTDP1
SCHEMBL727529 0.73 TSHR (0.31) TSHR
SCHEMBL599877 0.72 TSHR (0.50) TSHRTDP1
SCHEMBL10046586 0.71
SCHEMBL19101383 0.71 TSHR (0.33) TSHRTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250145846-A1 COMPOSITION FOR ELECTROCHEMICAL DEVICE AND METHOD OF PRODUCING SAME, BINDER COMPOSITION FOR ELECTROCHEMICAL DEVICE, CONDUCTIVE MATERIAL DISPERSION LIQUID FOR ELECTROCHEMICAL DEVICE, SLURRY FOR ELECTROCHEMICAL DEVICE ELECTRODE, ELECTRODE FOR ELECTROCHEMICAL DEVICE, AND ELECTROCHEMICAL DEVICE ZEON CORPORATION (JP) 2025-05-08 US disclosed
EP-4489136-A1 COMPOSITION FOR ELECTROCHEMICAL ELEMENTS, METHOD FOR PRODUCING SAME, BINDER COMPOSITION FOR ELECTROCHEMICAL ELEMENTS, CONDUCTIVE MATERIAL DISPERSION LIQUID FOR ELECTROCHEMICAL ELEMENTS, SLURRY FOR ELECTROCHEMICAL ELEMENT ELECTRODES, ELECTRODE FOR ELECTROCHEMICAL ELEMENTS, AND ELECTROCHEMICAL ELEMENT Zeon Corporation (JP) 2025-01-08 EP disclosed
US-11984600-B2 Binder composition for electrochemical device, conductive material dispersion liquid for electrochemical device, slurry for electrochemical device electrode, electrode for electrochemical device, and electrochemical device ZEON CORPORATION (JP) 2024-05-14 US disclosed
WO-2023162835-A1 COMPOSITION FOR ELECTROCHEMICAL ELEMENTS, METHOD FOR PRODUCING SAME, BINDER COMPOSITION FOR ELECTROCHEMICAL ELEMENTS, CONDUCTIVE MATERIAL DISPERSION LIQUID FOR ELECTROCHEMICAL ELEMENTS, SLURRY FOR ELECTROCHEMICAL ELEMENT ELECTRODES, ELECTRODE FOR ELECTROCHEMICAL ELEMENTS, AND ELECTROCHEMICAL ELEMENT 日本ゼオン株式会社 2023-08-31 WO disclosed
US-20230268513-A1 BINDER COMPOSITION FOR ELECTROCHEMICAL DEVICE, CONDUCTIVE MATERIAL DISPERSION LIQUID FOR ELECTROCHEMICAL DEVICE, SLURRY FOR ELECTROCHEMICAL DEVICE ELECTRODE, ELECTRODE FOR ELECTROCHEMICAL DEVICE, AND ELECTROCHEMICAL DEVICE ZEON CORPORATION (JP) 2023-08-24 US disclosed
EP-4207345-A1 BINDER COMPOSITION FOR ELECTROCHEMICAL ELEMENTS, CONDUCTIVE MATERIAL DISPERSION LIQUID FOR ELECTROCHEMICAL ELEMENTS, SLURRY FOR ELECTROCHEMICAL ELEMENT ELECTRODES, ELECTRODE FOR ELECTROCHEMICAL ELEMENTS, AND ELECTROCHEMICAL ELEMENT Zeon Corporation (JP) 2023-07-05 EP disclosed
CN-109153653-B Novel compound, photocurable composition, cured product thereof, printing ink, and printed matter using the printing ink DIC株式会社 2022-06-28 CN disclosed
US-11079675-B2 Compound, photocurable composition, cured product of same, printing ink, and printed matter curing the printing ink DIC CORPORATION (JP) 2021-08-03 US disclosed
CN-111954848-A Photosensitive resin composition, cured product, insulating material, resin material for solder resist, and resist member DIC株式会社 2020-11-17 CN disclosed
WO-2019198490-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, RESIN MATERIAL FOR SOLDER RESISTS AND RESIST MEMBER DIC株式会社 2019-10-17 WO disclosed
US-20190137872-A1 NOVEL COMPOUND, PHOTOCURABLE COMPOSITION, CURED PRODUCT OF SAME, PRINTING INK, AND PRINTED MATTER SURING THE PRINTING INK DIC CORPORATION (JP) 2019-05-09 US disclosed
CN-109153653-A New compound, Photocurable composition, its solidfied material, printing ink and the printed article for having used the printing ink DIC株式会社 2019-01-04 CN disclosed
US-20160068717-A1 Multi-Layer Barrier Adhesive Film HENKEL CORPORATION 2016-03-10 US disclosed
US-20150210882-A1 CURABLE ELASTOMER COMPOSITIONS WITH LOW TEMPERATURE SEALING CAPABILITY HENKEL AG & CO. KGAA (DE) 2015-07-30 US disclosed
US-20130287980-A1 CURABLE ELASTOMER COMPOSITIONS WITH LOW TEMPERATURE SEALING CAPABILITY HENKEL CORPORATION (US) 2013-10-31 US disclosed
US-8063154-B2 Preparation of exo-olefin terminated polyolefins via quenching with alkoxysilanes or ethers THE UNIVERSITY OF SOUTHERN MISSISSIPPI (US) 2011-11-22 US disclosed
US-20090318624-A1 Preparation of exo-olefin terminated polyolefins via quenching with alkoxysilanes or ethers UNIVERSITY OF SOUTHERN MISSISSIPPI 2009-12-24 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11079675-B2 Compound, photocurable composition, cured product of same, printing ink, and printed matter curing the printing ink EPB41, F12, CDK1 TSHR 4803/4885TDP1 1940/4885
US-20190137872-A1 NOVEL COMPOUND, PHOTOCURABLE COMPOSITION, CURED PRODUCT OF SAME, PRINTING INK, AND PRINTED MATTER SURING THE PRINTING INK EPB41, CDK1, CDKN1A TSHR 4758/4885TDP1 1340/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.