⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Trimethylammonium SCHEMBL27259031 | 0.82 | — | — | |
| SCHEMBL9093617 | 0.72 | MEN1 (0.86) | — | |
| SCHEMBL31709992 | 0.72 | MEN1 (0.86) | — | |
| SCHEMBL136652 | 0.72 | — | — | |
| SCHEMBL14916717 | 0.72 | MEN1 (0.86) | — | |
| SCHEMBL23398193 | 0.67 | MEN1 (0.75) | — | |
| SCHEMBL1037408 | 0.67 | MEN1 (0.75) | — | |
| SCHEMBL144783 | 0.67 | MEN1 (0.75) | — | |
| SCHEMBL2027908 | 0.67 | MEN1 (0.75) | — | |
| SCHEMBL135900 | 0.67 | MEN1 (0.75) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1156 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119798297-A | Chromophore, packaging adhesive film, glass and photovoltaic module with down-conversion capability | 常州斯威克光伏新材料有限公司 | 2025-04-11 | — | — | CN | claimed |
| CN-119569046-A | Preparation method of light reduced graphene oxide@silicon dioxide electromagnetic wave absorbing material | 姜大海 | 2025-03-07 | — | — | CN | claimed |
| CN-117019107-B | Blast furnace gas purifying adsorbent and preparation method and application thereof | 星远智维邯郸环境科技有限公司 | 2023-12-15 | — | — | CN | claimed |
| CN-117177600-A | display device | 京东方科技集团股份有限公司 | 2023-12-05 | — | — | CN | claimed |
| CN-117019107-A | Blast furnace gas purifying adsorbent and preparation method and application thereof | 星远智维邯郸环境科技有限公司 | 2023-11-10 | — | — | CN | claimed |
| CN-115088089-B | Organic electroluminescent device and display device | 京东方科技集团股份有限公司 | 2023-09-29 | — | — | CN | claimed |
| CN-115088089-A | Organic electroluminescent device and display apparatus | 京东方科技集团股份有限公司 | 2022-09-20 | — | — | CN | claimed |
| CN-110668838-B | Carbon-ceramic brake component and preparation method thereof | 贵阳天龙摩擦材料有限公司 | 2022-04-01 | — | — | CN | claimed |
| CN-113026369-B | Ceramizable coating coated fiber and preparation method and application thereof | 西北工业大学 | 2022-03-11 | — | — | CN | claimed |
| CN-110041089-B | Carbon/ceramic friction material and preparation method thereof | 西安航空制动科技有限公司 | 2021-12-28 | — | — | CN | claimed |
| CN-110131343-B | Preparation method of automobile brake disc | 西安航空制动科技有限公司 | 2021-02-02 | — | — | CN | claimed |
| CN-112010656-A | Hafnium oxide fiber, preparation method thereof and application thereof in oxidation-resistant coating | 华中科技大学 | 2020-12-01 | — | — | CN | claimed |
| CN-111978093-A | High-temperature carbon-based brake disc and manufacturing method thereof | 杜涛 | 2020-11-24 | — | — | CN | claimed |
| CN-111793434-A | Preparation method of high-temperature-resistant ceramic anticorrosive heat-insulating coating | 安徽新大陆特种涂料有限责任公司 | 2020-10-20 | — | — | CN | claimed |
| CN-110668838-A | Carbon-ceramic brake component and preparation method thereof | 贵阳天龙摩擦材料有限公司 | 2020-01-10 | — | — | CN | claimed |
| CN-109959639-A | Light detection device with protective pad and method relating thereto | 伊鲁米那股份有限公司 | 2019-07-02 | — | — | CN | claimed |
| CN-107226908-A | A kind of high dioptric substances and its synthetic method | 杭州师范大学 | 2017-10-03 | — | — | CN | claimed |
| CN-107057136-A | A kind of anti-skidding unvulcanized rubber material of self-healing property and preparation method | 成都微熵科技有限公司 | 2017-08-18 | — | — | CN | claimed |
| US-7091119-B2 | Encapsulated MOS transistor gate structures and methods for making the same | TEXAS INSTRUMENTS INCORPORATED (US) | 2006-08-15 | — | — | US | claimed |
| US-6884659-B2 | Thin interface layer to improve copper etch stop | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2005-04-26 | — | — | US | claimed |