Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3118339 | 0.83 | — | — | |
| SCHEMBL17210477 | 0.80 | MEN1 (0.37) | TSHR | |
| SCHEMBL3180339 | 0.79 | TSHR (0.39) | TSHR | |
| SCHEMBL12713323 | 0.79 | MEN1 (0.47) | — | |
| SCHEMBL2852813 | 0.78 | TSHR (0.32) | TSHR | |
| SCHEMBL1793953 | 0.77 | — | — | |
| SCHEMBL28626224 | 0.75 | TSHR (0.48) | TSHR | |
| SCHEMBL2764329 | 0.75 | TSHR (0.48) | TSHR | |
| SCHEMBL22443202 | 0.75 | — | — | |
| SCHEMBL81639 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 56 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7166242-B2 | Composition, organic conductive layer including composition, method for manufacturing organic conductive layers, organic EL element including organic conductive layer, method for manufacturing organic EL elements semiconductor element including organic conductive layer, method for manufacturing semiconductor elements, electronic device, and electronic apparatus | SEIKO EPSON CORPORATION (JP) | 2007-01-23 | — | — | US | claimed |
| US-20040144975-A1 | Composition, organic conductive layer including composition, method for manufacturing organic conductive layers, organic El element including organic conductive layer, method for manufacturing organic El elements, semiconductor element including organic conductive layer, method for manufacturing semiconductor elements, electronic device, and electronic apparatus | SEIKO EPSON CORPORATION. (JP) | 2004-07-29 | — | — | US | claimed |
| EP-3673015-B1 | INJECTION MOLDABLE SILICONE COMPOSITION | DOW SILICONES CORP (US) | 2024-01-03 | — | — | EP | disclosed |
| US-11453149-B2 | Injection moldable silicone composition | DOW SILICONES CORPORATION (US) | 2022-09-27 | — | — | US | disclosed |
| CN-110997814-B | Injection moldable silicone compositions | 美国陶氏有机硅公司 | 2022-08-23 | — | — | CN | disclosed |
| US-20200291187-A1 | CURABLE SILICONE COMPOSITION WITH REDUCED MOLD FOULING | DOW SILICONES CORPORATION (US) | 2020-09-17 | — | — | US | disclosed |
| EP-3673015-A1 | INJECTION MOLDABLE SILICONE COMPOSITION | Dow Silicones Corporation (US) | 2020-07-01 | — | — | EP | disclosed |
| EP-2831175-B1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | DOW CORNING TORAY CO LTD (JP) | 2020-06-17 | — | — | EP | disclosed |
| US-20200139594-A1 | INJECTION MOLDABLE SILICONE COMPOSITION | DOW SILICONES CORPORATION | 2020-05-07 | — | — | US | disclosed |
| CN-110997814-A | Injection moldable silicone compositions | 美国陶氏有机硅公司 | 2020-04-10 | — | — | CN | disclosed |
| EP-3630892-A1 | CURABLE SILICONE COMPOSITION WITH REDUCED MOLD FOULING | Dow Silicones Corporation (US) | 2020-04-08 | — | — | EP | disclosed |
| US-20100190396-A1 | SILICONE RUBBER COMPOSITION FOR FABRIC COATING AND COATED FABRIC | DOW CORNING TORAY COMPANY, LTD. (JP) | 2010-07-29 | — | — | US | disclosed |
| US-20100190395-A1 | SILICONE RUBBER COMPOSITION FOR COATING OF WOVEN FABRIC, AND COATED WOVEN FABRIC | DOW TORAY CO., LTD. (JP) | 2010-07-29 | — | — | US | disclosed |
| WO-2010076893-A1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION AND POROUS CURED ORGANOPOLYSILOXANE MATERIAL | DOW CORNING TORAY CO., LTD. (JP) | 2010-07-08 | — | — | WO | disclosed |
| EP-2170996-A1 | CURABLE SILICONE COMPOSITION | Dow Corning Toray Co., Ltd. (JP) | 2010-04-07 | — | — | EP | disclosed |
| EP-2053160-A1 | SILICONE RUBBER COMPOSITION FOR COATING OF WOVEN FABRIC, AND COATED WOVEN FABRIC | Dow Corning Toray Co., Ltd. (JP) | 2009-04-29 | — | — | EP | disclosed |
| EP-2053161-A1 | SILICONE RUBBER COMPOSITION FOR FABRIC COATING AND COATED FABRIC | Dow Corning Toray Co., Ltd. (JP) | 2009-04-29 | — | — | EP | disclosed |
| WO-2009017251-A1 | CURABLE SILICONE COMPOSITION | DOW CORNING TORAY CO., LTD. (JP) | 2009-02-05 | — | — | WO | disclosed |
| US-7166242-B2 | Composition, organic conductive layer including composition, method for manufacturing organic conductive layers, organic EL element including organic conductive layer, method for manufacturing organic EL elements semiconductor element including organic conductive layer, method for manufacturing semiconductor elements, electronic device, and electronic apparatus | SEIKO EPSON CORPORATION (JP) | 2007-01-23 | — | — | US | disclosed |
| US-20040144975-A1 | Composition, organic conductive layer including composition, method for manufacturing organic conductive layers, organic El element including organic conductive layer, method for manufacturing organic El elements, semiconductor element including organic conductive layer, method for manufacturing semiconductor elements, electronic device, and electronic apparatus | SEIKO EPSON CORPORATION. (JP) | 2004-07-29 | — | — | US | disclosed |