SCHEMBL6819474

SCHEMBL6819474

CCC1(N=C=N)CCCCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2767294 0.79
SCHEMBL11264766 0.77
SCHEMBL3826644 0.77
SCHEMBL11056868 0.74
SCHEMBL5932657 0.72
SCHEMBL1376475 0.69
SCHEMBL18265848 0.69
SCHEMBL10395672 0.67
SCHEMBL21806654 0.64
SCHEMBL21806665 0.64

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0177793-B1 PROCESS FOR PREPARING POLYAMIDES Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1990-11-28 EP claimed
US-4645823-A CORROSION RESISTANCE; NONTOXIC ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1987-02-24 US claimed
EP-0177793-A2 Process for preparing polyamides Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1986-04-16 EP claimed
US-20260036904-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-02-05 US disclosed
CN-120129875-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2025-06-10 CN disclosed
US-12312601-B2 Culture substrate, method for manufacturing culture substrate, and culturing method and culturing device for stem cell KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION (JP) 2025-05-27 US disclosed
CN-118676106-A Semiconductor device and method for manufacturing the same 旭化成株式会社 2024-09-20 CN disclosed
CN-118448385-A Semiconductor device and method for manufacturing the same 旭化成株式会社 2024-08-06 CN disclosed
CN-118448386-A Semiconductor device and method for manufacturing the same 旭化成株式会社 2024-08-06 CN disclosed
WO-2024090486-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE 旭化成株式会社 2024-05-02 WO disclosed
CN-111384021-B Semiconductor device and method for manufacturing the same 旭化成株式会社 2024-04-16 CN disclosed
CN-111384021-A Semiconductor device and method for manufacturing the same 旭化成株式会社 2020-07-07 CN disclosed
WO-2019176867-A1 CULTURE SUBSTRATE, METHOD FOR MANUFACTURING CULTURE SUBSTRATE, AND CULTURING METHOD AND CULTURING DEVICE FOR STEM CELL 国立大学法人九州大学 2019-09-19 WO disclosed
CN-110088680-A The double-deck photosensitive layer volume 旭化成株式会社 2019-08-02 CN disclosed
US-20150247126-A1 METHOD OF CULTURING INDUCED PLURIPOTENT STEM CELL AND MATERIAL FOR CULTURING THE SAME NATIONAL UNIVERSITY CORPORATION KYUSHU UNIVERSITY (JP) 2015-09-03 US disclosed
EP-1219662-B1 POLYAMIC ACID ESTER ASAHI CHEMICAL IND (JP) 2004-08-04 EP disclosed
US-6610815-B1 Photomask; pyromellitic acid and oxydiphthalic acid monomers ASAHI KASEI KABUSHIKI KAISHA (JP) 2003-08-26 US disclosed
EP-1219662-A1 POLYAMIC ACID ESTER Asahi Kasei Kabushiki Kaisha (JP) 2002-07-03 EP disclosed
US-5648451-A Process for producing photosensitive resin SUMITOMO BAKELITE COMPANY LIMITED (JP) 1997-07-15 US disclosed
US-4645823-A CORROSION RESISTANCE; NONTOXIC ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1987-02-24 US disclosed