SCHEMBL681976

SCHEMBL681976

C[Si]1(C)O[Si](C)(C)O[Si]2(O1)O[Si](C)(C)O[Si](C)(O)O[Si](C)(C)O2

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20135740 0.90
SCHEMBL682112 0.90
SCHEMBL682115 0.90
SCHEMBL20677255 0.87
SCHEMBL9577879 0.83
SCHEMBL20677257 0.83
SCHEMBL13233302 0.78
SCHEMBL18858694 0.75
SCHEMBL682150 0.73
SCHEMBL2996373 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8389630-B2 Curable composition KANEKA CORPORATION (JP) 2013-03-05 US disclosed
US-8067498-B2 Transparent curable polymer; one package process; high strength, elongation, weatherproofing, adhesive; blend containing vinyl living polymer, containing crosslinkable silicon groups, graft polymer containing rubber and acrylic ester with vinyl monomer and silica filler KANEKA CORPORATION (JP) 2011-11-29 US disclosed
US-7977399-B2 Curable composition KANEKA CORPORATION (JP) 2011-07-12 US disclosed
US-7807746-B2 Curable composition KANEKA CORPORATION (JP) 2010-10-05 US disclosed
US-20100227949-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2010-09-09 US disclosed
US-20100222449-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2010-09-02 US disclosed
US-20100105798-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2010-04-29 US disclosed
US-20090292075-A1 CURABLE COMPOSITION FOR DAMPING MATERIAL AND DAMPING MATERIAL KANEKA CORPORATION (JP) 2009-11-26 US disclosed
US-7601781-B2 Curable compositions KANEKA CORPORATION (JP) 2009-10-13 US disclosed
US-20090234072-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2009-09-17 US disclosed
US-20090192265-A1 Curable composition KANEKA CORPORATION (JP) 2009-07-30 US disclosed
US-7511102-B2 Polymer and liquid gasket for In-Place forming KANEKA CORPORATION (JP) 2009-03-31 US disclosed
US-20080200613-A1 Curable Composition KANEKA CORPORATION (JP) 2008-08-21 US disclosed
US-20080177001-A1 CURABLE COMPOSITIONS KANEKA CORPORATION (JP) 2008-07-24 US disclosed
US-7388038-B2 Curable compositions KANEKA CORPORATION (JP) 2008-06-17 US disclosed
US-20070213459-A1 Curable Composition KANEKA CORPORATION (JP) 2007-09-13 US disclosed
US-20070167583-A1 Curable composition KANEKA CORPORATION (JP) 2007-07-19 US disclosed
US-20070161732-A1 Novel polymer and liquid gasket for In-Place forming KANEKA CORPORATION (JP) 2007-07-12 US disclosed
US-7186780-B2 Polymer and liquid gasket for in-place forming KANEKA CORPORATION (JP) 2007-03-06 US disclosed
US-20070015893-A1 Curable composition and its use MITSUI CHEMICALS, INC. 2007-01-18 US disclosed