SCHEMBL682198

SCHEMBL682198

C=C[Si](C)(C)O[Si](C)(C)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20312543 0.95
SCHEMBL5831872 0.95
SCHEMBL1493180 0.85
SCHEMBL8825608 0.82
SCHEMBL80200 0.82
SCHEMBL18079763 0.82
SCHEMBL680313 0.82
SCHEMBL19999739 0.80
SCHEMBL12387143 0.80
SCHEMBL3483256 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12303518-B2 System for providing birth control THE POPULATION COUNCIL, INC. (US) 2025-05-20 US disclosed
US-20240252428-A1 METHODS OF PROVIDING BIRTH CONTROL THE POPULATION COUNCIL INC (US) 2024-08-01 US disclosed
US-12043740-B2 Light transmittance control film and composition for the light transmittance control film ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE (KR) 2024-07-23 US disclosed
US-11850251-B2 System for providing birth control THE POPULATION COUNCIL, INC. (US) 2023-12-26 US disclosed
US-20230240982-A1 SYSTEM FOR PROVIDING BIRTH CONTROL THE POPULATION COUNCIL, INC. (US) 2023-08-03 US disclosed
US-11529308-B2 System for providing birth control THE POPULATION COUNCIL, INC. (US) 2022-12-20 US disclosed
EP-3986375-A1 SYSTEM FOR PROVIDING BIRTH CONTROL THE POPULATION COUNCIL, INC. (US) 2022-04-27 EP disclosed
CN-114364369-A System for providing birth control 人口理事会公司 2022-04-15 CN disclosed
US-20220054503-A1 SYSTEM FOR PROVIDING BIRTH CONTROL THE POPULATION COUNCIL, INC. (US) 2022-02-24 US disclosed
US-20210290637-A1 SYSTEM FOR PROVIDING BIRTH CONTROL THE POPULATION COUNCIL, INC. (US) 2021-09-23 US disclosed
US-20090115031-A1 SEMICONDUCTOR DEVICE INCLUDING A COUPLED DIELECTRIC LAYER AND METAL LAYER, METHOD OF FABRICATION THEREOF, AND PASSIVATING COUPLING MATERIAL COMPRISING MULTIPLE ORGANIC COMPONENTS FOR USE IN A SEMICONDUCTOR DEVICE FREESCALE SEMICONDUCTOR, INC. (US) 2009-05-07 US disclosed
US-20090115031-A1 SEMICONDUCTOR DEVICE INCLUDING A COUPLED DIELECTRIC LAYER AND METAL LAYER, METHOD OF FABRICATION THEREOF, AND PASSIVATING COUPLING MATERIAL COMPRISING MULTIPLE ORGANIC COMPONENTS FOR USE IN A SEMICONDUCTOR DEVICE FREESCALE SEMICONDUCTOR, INC. (US) 2009-05-07 US disclosed
WO-2009007793-A1 COUPLING LAYER COMPOSITION FOR A SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, METHOD OF FORMING THE COUPLING LAYER, AND APPARATUS FOR THE MANUFACTURE OF A SEMICONDUCTOR DEVICE FREESCALE SEMICONDUCTOR, INC. (GB) 2009-01-15 WO disclosed
US-20080197487-A1 Semiconductor Device Including a Coupled Dielectric Layer and Metal Layer, Method of Fabrication Thereof, and Material for Coupling a Dielectric Layer and a Metal Layer in a Semiconductor Device NXP B.V. (NL) 2008-08-21 US disclosed
US-20080197487-A1 Semiconductor Device Including a Coupled Dielectric Layer and Metal Layer, Method of Fabrication Thereof, and Material for Coupling a Dielectric Layer and a Metal Layer in a Semiconductor Device NXP B.V. (NL) 2008-08-21 US disclosed
EP-1924632-A2 SEMICONDUCTOR DEVICE INCLUDING A COUPLED DIELECTRIC LAYER AND METAL LAYER, METHOD OF FABRICATION THEREOF, AND MATERIAL FOR COUPLING A DIELECTRIC LAYER AND A METAL LAYER IN A SEMICONDUCTOR DEVICE Freescale Semiconductor, Inc. (US) 2008-05-28 EP disclosed
WO-2007095972-A1 SEMICONDUCTORDEVICE INCLUDING A COUPLED DIELECTRIC LAYER AND METAL LAYER, METHOD OF FABRICATION THEREOF, AND PASSIVATING COUPLING MATERIAL COMPRISSING MULTIPLE ORGANIC COMPONENTS FOR USE IN A SEMICONDUCTOR DEVICE FREESCALE SEMICONDUCTOR, INC. (US) 2007-08-30 WO disclosed
WO-2007095973-A1 INTEGRATED SYSTEM FOR SEMICONDUCTOR SUBSTRATE PROCESSING USING LIQUID PHASE METAL DEPOSITION FREESCALE SEMICONDUCTOR, INC. (US) 2007-08-30 WO disclosed
WO-2007026010-A2 SEMICONDUCTOR DEVICE INCLUDING A COUPLED DIELECTRIC LAYER AND METAL LAYER, METHOD OF FABRICATION THEREOF, AND MATERIAL FOR COUPLING A DIELECTRIC LAYER AND A METAL LAYER IN A SEMICONDUCTOR DEVICE FREESCALE SEMICONDUCTOR, INC. (US) 2007-03-08 WO disclosed
WO-2007025565-A1 SEMICONDUCTOR DEVICE INCLUDING A COUPLED DIELECTRIC LAYER AND METAL LAYER, METHOD OF FABRICATION THEREOF, AND MATERIAL FOR COUPLING A DIELECTRIC LAYER AND A METAL LAYER IN A SEMICONDUCTOR DEVICE FREESCALE SEMICONDUCTOR, INC. (US) 2007-03-08 WO disclosed