Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 2/20 | 0.74 |
| ▸ | ESR2 | Q92731 | 2/20 | 0.74 |
| ▸ | SHBG | P04278 | 1/20 | 0.52 |
| ▸ | CA1 | P00915 | 1/20 | 0.47 |
| ▸ | CA2 | P00918 | 1/20 | 0.47 |
| ▸ | CA4 | P22748 | 1/20 | 0.47 |
| ▸ | CA6 | P23280 | 1/20 | 0.47 |
| ▸ | AMY1A | P0DUB6 | 1/20 | 0.46 |
| ▸ | MAPT | P10636 | 1/20 | 0.44 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.44 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.44 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.44 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.44 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.44 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.44 |
| ▸ | THRA | P10827 | 1/20 | 0.42 |
| ▸ | THRB | P10828 | 1/20 | 0.42 |
| ▸ | TP53 | P04637 | 1/20 | 0.42 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.42 |
| ▸ | SNCA | P37840 | 2/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30783352 | 1.00 | ESR1 (0.74) | ESR1ESR2SHBGCA1CA2 | |
| SCHEMBL4066304 | 1.00 | ESR1 (0.74) | ESR1ESR2SHBGCA1CA2 | |
| SCHEMBL4055517 | 0.95 | ESR1 (0.71) | ESR1ESR2SHBGCA1CA2 | |
| SCHEMBL3187895 | 0.95 | ESR1 (0.71) | ESR1ESR2SHBGCA1CA2 | |
| SCHEMBL29636483 | 0.95 | ESR1 (0.71) | ESR1ESR2SHBGCA1CA2 | |
| SCHEMBL4063169 | 0.95 | ESR1 (0.71) | ESR1ESR2SHBGCA1CA2 | |
| SCHEMBL14998992 | 0.93 | ESR1 (0.65) | ESR1ESR2SHBGCA1CA2 | |
| SCHEMBL8351876 | 0.93 | ESR1 (0.69) | ESR1ESR2SHBGCA1CA2 | |
| SCHEMBL4065316 | 0.90 | ESR1 (0.59) | ESR1ESR2SHBGCA1CA2 | |
| SCHEMBL30374567 | 0.89 | ESR1 (0.63) | ESR1ESR2SHBGCA1CA2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250376552-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2025-12-11 | — | — | US | disclosed |
| US-20250264801-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-08-21 | — | — | US | disclosed |
| EP-4596607-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4597225-A1 | FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4596608-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| US-20250236697-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-24 | — | — | US | disclosed |
| US-20250230283-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-17 | — | — | US | disclosed |
| WO-2024150700-A1 | RESIN COMPOSITION, CURED ARTICLE, MULTILAYER BODY, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN | 富士フイルム株式会社 | 2024-07-18 | — | — | WO | disclosed |
| WO-2024143209-A1 | METHOD FOR PRODUCING MULTILAYER BODY, PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143212-A1 | METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR MEMBER, AND RESIN COMPOSITION | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2022202647-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-09-29 | — | — | WO | disclosed |
| US-6716565-B2 | APPLICABLE TO IMAGE-FORMING MATERIALS SUCH AS THREE-DIMENSIONAL MODELLING BY LIGHT, HOLOGRAPHY, LITHOGRAPHIC PRINTING PLATES, COLOR PROOFS, PHOTORESISTS AND COLOR FILTERS, AND INKS, PAINTS AND ADHESIVES | FUJI PHOTO FILM CO., LTD. (JP) | 2004-04-06 | — | — | US | disclosed |
| US-20030057610-A1 | Applicable to image-forming materials such as three-dimensional modelling by light, holography, lithographic printing plates, color proofs, photoresists and color filters, and inks, paints and adhesives | FUJIFILM CORPORATION (JP) | 2003-03-27 | — | — | US | disclosed |
| EP-0786699-B1 | Positive photoresist composition | FUJI PHOTO FILM CO LTD (JP) | 2001-10-31 | — | — | EP | disclosed |
| EP-0745575-B1 | Method of synthesizing polyphenol compound and positive working photoresist composition comprising polyphenol compound | FUJI PHOTO FILM CO LTD (JP) | 2000-09-06 | — | — | EP | disclosed |
| EP-0766139-B1 | Positive working photoresist composition | FUJI PHOTO FILM CO LTD (JP) | 1998-03-25 | — | — | EP | disclosed |
| EP-0786699-A1 | Positive photoresist composition | Fuji Photo Film Co., Ltd. (JP) | 1997-07-30 | — | — | EP | disclosed |
| US-5620828-A | Positive photoresist composition containing quinonediazide esterification product, novolak resin and pocyhydroxy alkali dissolution accelerator | FUJI PHOTO FILM CO., LTD. (JP) | 1997-04-15 | — | — | US | disclosed |
| EP-0766139-A1 | Positive working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1997-04-02 | — | — | EP | disclosed |
| EP-0745575-A1 | Method of synthesizing polyphenol compound and positive working photoresist composition comprising polyphenol compound | FUJI PHOTO FILM CO., LTD. (JP) | 1996-12-04 | — | — | EP | disclosed |