SCHEMBL6849113

SCHEMBL6849113

C=CCOCCOC(=O)c1ccccc1C(=O)OCCOCC=C

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ CYP3A4 P08684 4/20 0.71
▸ TSHR P16473 9/20 0.57
▸ ALDH1A1 P00352 9/20 0.57
▸ HSD17B10 Q99714 4/20 0.57
▸ TDP1 Q9NUW8 4/20 0.50
▸ L3MBTL1 Q9Y468 3/20 0.50
▸ MAPK1 P28482 3/20 0.49
▸ TP53 P04637 2/20 0.49
▸ LMNA P02545 1/20 0.47
▸ NPC1 O15118 3/20 0.44
▸ HPGD P15428 2/20 0.44
▸ RAB9A P51151 2/20 0.44
▸ SMN1; SMN2 Q16637 2/20 0.44
▸ GLA P06280 1/20 0.44
▸ HIF1A Q16665 1/20 0.44
▸ LIG1 P18858 1/20 0.43
▸ KDM4E B2RXH2 1/20 0.43
▸ MEN1 O00255 1/20 0.43
▸ NFKB1 P19838 1/20 0.43
▸ NFKB2 Q00653 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8167933 0.93 CYP3A4 (0.83) CYP3A4TSHRALDH1A1HSD17B10TDP1
SCHEMBL22672755 0.92 CYP3A4 (0.61) CYP3A4TSHRALDH1A1HSD17B10TDP1
SCHEMBL9421260 0.89 CYP3A4 (0.89) CYP3A4TSHRALDH1A1HSD17B10TDP1
SCHEMBL27497075 0.86 CYP3A4 (0.89) CYP3A4TSHRALDH1A1HSD17B10TDP1
SCHEMBL28272813 0.85 CYP3A4 (0.75) CYP3A4TSHRALDH1A1HSD17B10TDP1
SCHEMBL8469179 0.85 TDP1 (0.58) CYP3A4TSHRALDH1A1HSD17B10TDP1
SCHEMBL23864812 0.84 CYP3A4 (0.51) CYP3A4TSHRALDH1A1HSD17B10TDP1
SCHEMBL16371573 0.83 CYP3A4 (1.00) CYP3A4TSHRALDH1A1HSD17B10TDP1
SCHEMBL29362146 0.83 CYP3A4 (1.00) CYP3A4TSHRALDH1A1HSD17B10TDP1
SCHEMBL27474785 0.83 CYP3A4 (1.00) CYP3A4TSHRALDH1A1HSD17B10TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6773809-B1 HIGH ADHERING PROPERTY AT A NORMAL TEMPERATURE AND A HIGH TEMPERATURE, LOW DIELECTRIC CONSTANT AND LOW DIELECTRIC LOSS TANGENT AND A COPPER FOIL ARE INCORPORATED KANEKA CORPORATION (JP) 2004-08-10 — — US disclosed
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