⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16667047 | 0.86 | — | — | |
| SCHEMBL1135113 | 0.75 | — | — | |
| SCHEMBL617601 | 0.74 | — | — | |
| SCHEMBL1135114 | 0.73 | — | — | |
| SCHEMBL6857386 | 0.73 | — | — | |
| Hydrochloric Acid SCHEMBL5086148 | 0.72 | — | — | |
| SCHEMBL4870610 | 0.72 | — | — | |
| SCHEMBL8381095 | 0.71 | — | — | |
| SCHEMBL5395957 | 0.71 | — | — | |
| SCHEMBL6857366 | 0.70 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3893054-B1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORP (JP) | 2026-05-06 | — | — | EP | disclosed |
| US-12393116-B2 | Pattern forming method, photosensitive resin composition, cured film, laminate, and device | FUJIFILM CORPORATION (JP) | 2025-08-19 | — | — | US | disclosed |
| EP-3893053-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE | FUJIFILM CORP (JP) | 2025-01-22 | — | — | EP | disclosed |
| US-12078929-B2 | Photosensitive resin composition, pattern forming method, cured film, laminate, and device | FUJIFILM CORPORATION (JP) | 2024-09-03 | — | — | US | disclosed |
| CN-113168093-B | Pattern forming method, photosensitive resin composition, cured film, laminate, and device | 富士胶片株式会社 | 2024-04-30 | — | — | CN | disclosed |
| CN-113383273-B | Photosensitive resin composition, pattern forming method, cured film, laminate, and device | 富士胶片株式会社 | 2023-11-14 | — | — | CN | disclosed |
| CN-114402256-A | Organic film, method for producing same, composition, laminate, and semiconductor device | 富士胶片株式会社 | 2022-04-26 | — | — | CN | disclosed |
| EP-3893054-A1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM Corporation (JP) | 2021-10-13 | — | — | EP | disclosed |
| EP-3893053-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE | FUJIFILM Corporation (JP) | 2021-10-13 | — | — | EP | disclosed |
| US-20210302835-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORPORATION (JP) | 2021-09-30 | — | — | US | disclosed |
| EP-0690079-B1 | ETHYLENE COPOLYMER, THERMOPLASTIC RESIN COMPOSITION CONTAINING THE SAME, AND PROCESS FOR PRODUCING ETHYLENE COPOLYMER | IDEMITSU KOSAN CO (JP) | 2002-07-03 | — | — | EP | disclosed |
| EP-0683184-B1 | POLYETHYLENE, THERMOPLASTIC RESIN COMPOSITION CONTAINING THE SAME, AND PROCESS FOR PRODUCING POLYETHYLENE | IDEMITSU KOSAN CO (JP) | 2002-06-12 | — | — | EP | disclosed |
| EP-1209171-A1 | PROCESS FOR PRODUCING OLEFIN LIVING POLYMER | JAPAN as Represented by DIRECTOR GENERAL OF AGENCY OF INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) | 2002-05-29 | — | — | EP | disclosed |
| US-6121402-A | EXCELLENT IN WORKING PROPERTIES AND PERMITS THE CONTROL OF PHYSICAL PROPERTIES SUCH AS DENSITY, A MELTING POINT AND CRYSTALLINITY MAINLY IN THE STATE OF A HOMOPOLYMER | IDEMITSU KOSAN CO., LTD. (JP) | 2000-09-19 | — | — | US | disclosed |
| EP-0686649-B1 | PROPYLENE BLOCK COPOLYMER, PROCESS FOR PRODUCING THE SAME, AND MODIFIED COPOLYMER PRODUCED THEREFROM | IDEMITSU KOSAN CO (JP) | 2000-08-02 | — | — | EP | disclosed |
| US-5747620-A | CATALYTIC ADDITION POLYMERIZATION WITH COORDINATION CATALYSTS | IDEMITSU KOSAN CO., LTD. (JP) | 1998-05-05 | — | — | US | disclosed |
| US-5670580-A | POLYMERS FOR ANTISTATIC AGENTS, ADHESIVES AND FIREPROOFING | IDEMITSU KOSAN CO., LTD. (JP) | 1997-09-23 | — | — | US | disclosed |
| EP-0690079-A1 | ETHYLENE COPOLYMER, THERMOPLASTIC RESIN COMPOSITION CONTAINING THE SAME, AND PROCESS FOR PRODUCING ETHYLENE COPOLYMER | IDEMITSU KOSAN COMPANY LIMITED (JP) | 1996-01-03 | — | — | EP | disclosed |
| EP-0686649-A1 | PROPYLENE BLOCK COPOLYMER, PROCESS FOR PRODUCING THE SAME, AND MODIFIED COPOLYMER PRODUCED THEREFROM | IDEMITSU KOSAN COMPANY LIMITED (JP) | 1995-12-13 | — | — | EP | disclosed |
| EP-0683184-A1 | POLYETHYLENE, THERMOPLASTIC RESIN COMPOSITION CONTAINING THE SAME, AND PROCESS FOR PRODUCING POLYETHYLENE | IDEMITSU KOSAN COMPANY LIMITED (JP) | 1995-11-22 | — | — | EP | disclosed |