Ammonia Solution, Strong

Ammonia Solution, Strong

SCHEMBL6862918

O=S(=O)([O-])OOS(=O)(=O)[O-].O=S(=O)([O-])OOS(=O)(=O)[O-].[Fe+3].[NH4+]

nearest known ligand 0.31

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Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.31
ALDH1A1 P00352 1/20 0.31
TSHR P16473 1/20 0.31
KMT2A Q03164 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Sulfuric Acid SCHEMBL8407732 0.96
SCHEMBL385808 0.96 MEN1 (0.33) MEN1ALDH1A1TSHRKMT2A
Ammonia Solution, Strong SCHEMBL28265073 0.92 MEN1 (0.31) MEN1ALDH1A1TSHRKMT2A
Ammonia Solution, Strong SCHEMBL27999510 0.92 MEN1 (0.31) MEN1ALDH1A1TSHRKMT2A
Ammonia Solution, Strong SCHEMBL27915908 0.92 MEN1 (0.31) MEN1ALDH1A1TSHRKMT2A
Ammonia Solution, Strong SCHEMBL31236749 0.92 MEN1 (0.31) MEN1ALDH1A1TSHRKMT2A
Ammonia Solution, Strong SCHEMBL31474247 0.92 MEN1 (0.31) MEN1ALDH1A1TSHRKMT2A
Ammonia Solution, Strong SCHEMBL6525819 0.92 MEN1 (0.31) MEN1ALDH1A1TSHRKMT2A
Ammonia Solution, Strong SCHEMBL4377162 0.92 MEN1 (0.31) MEN1ALDH1A1TSHRKMT2A
Ammonia Solution, Strong SCHEMBL27809983 0.92 MEN1 (0.31) MEN1ALDH1A1TSHRKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5582958-A USEFUL IN REHALOGENATING FERRIC CHELATE BLEACHES EASTMAN KODAK COMPANY (US) 1996-12-10 US claimed
JP-1319503-A None JP disclosed
US-6818031-B2 A POLISHING FORMUALTION CONSISTS OF AN ABRASIVE, AN OXIDIZING AGENT, A POLISHING ACCELERATOR(AN ORGANIC PHOSPHONIC ACID), AND WATER KAO CORPORATION (JP) 2004-11-16 US disclosed
US-20020194789-A1 A polishing formualtion consists of an abrasive, an oxidizing agent, a polishing accelerator(an organic phosphonic acid), and water KAO CORPORATION (JP) 2002-12-26 US disclosed
JP-H01319503-A MANUFACTURE OF HIGH-SOLID WATER-SOLUBLE POLYMER USING EXOTHERMIC POLYMERIZATION AMERICAN CYANAMID CO 1989-12-25 JP disclosed