Ammonia Solution, Strong

Ammonia Solution, Strong

SCHEMBL6866047

BB.N

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ammonia Solution, Strong SCHEMBL11594289 1.00
Methane SCHEMBL9063041 0.87
SCHEMBL539 0.82
Fluoride SCHEMBL3084625 0.67
Helium SCHEMBL7035046 0.67
SCHEMBL23040651 0.67
SCHEMBL7367290 0.67
SCHEMBL1396185 0.67
SCHEMBL723481 0.67
Water SCHEMBL562865 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210062332-A1 COMPONENT COATED WITH MULTIPLE TWO-DIMENSIONAL LAYERS, AND COATING METHOD AIXTRON SE (DE) 2021-03-04 US disclosed
CN-112272715-A Component coated with a plurality of two-dimensional coatings and coating method 艾克斯特朗欧洲公司 2021-01-26 CN disclosed
US-10384994-B2 Open-flask hydroboration and the use thereof PURDUE RESEARCH FOUNDATION (US) 2019-08-20 US disclosed
US-20180050972-A1 OPEN-FLASK HYDROBORATION AND THE USE THEREOF PURDUE RESEARCH FOUNDATION (US) 2018-02-22 US disclosed
CN-103201251-B By the method for benzylamine compound initial preparation 2,2-difluoroethylamine BAYER INTELLECTUAL PROPERTY GMBH (DE) 2015-12-02 CN disclosed
CN-101309693-A Use of amine-borane compounds as anti-microbial agents YISSUM RES DEV CO (IL) 2008-11-19 CN disclosed
US-6821891-B2 Atomic layer deposition of copper using a reducing gas and non-fluorinated copper precursors APPLIED MATERIALS, INC. 2004-11-23 US disclosed
US-20030129308-A1 Atomic layer deposition of copper using a reducing gas and non-fluorinated copper precursors APPLIED MATERIALS, INC. 2003-07-10 US disclosed
WO-2003044242-A2 ATOMIC LAYER DEPOSITION OF COPPER USING A REDUCING GAS AND NON-FLUORINATED COPPER PRECURSORS APPLIED MATERIALS, INC. (US) 2003-05-30 WO disclosed
EP-0666602-A2 Solar cell and method for manufacturing the same MITSUBISHI DENKI KABUSHIKI KAISHA (JP) 1995-08-09 EP disclosed
EP-0511718-A2 Solar cell and method for manufacturing the same MITSUBISHI DENKI KABUSHIKI KAISHA (JP) 1992-11-04 EP disclosed
EP-0509614-A1 Solar cell MITSUBISHI DENKI KABUSHIKI KAISHA (JP) 1992-10-21 EP disclosed
EP-0509615-A2 Solar cell MITSUBISHI DENKI KABUSHIKI KAISHA (JP) 1992-10-21 EP disclosed
EP-0507420-A1 Method for Manufacturing a Solar Cell MITSUBISHI DENKI KABUSHIKI KAISHA (JP) 1992-10-07 EP disclosed
US-5075292-A Agriculture CHEVRON RESEARCH AND TECHNOLOGY COMPANY (US) 1991-12-24 US disclosed
EP-0455360-A1 Method of manufacturing a solar cell MITSUBISHI DENKI KABUSHIKI KAISHA (JP) 1991-11-06 EP disclosed
US-4522849-A Method for coating quartz with boron nitride GENERAL ELECTRIC COMPANY (US) 1985-06-11 US disclosed