SCHEMBL6882262

SCHEMBL6882262

O=C1OC(=O)C2CC[CH]CC12

nearest known ligand 0.34

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.34
GMNN O75496 1/20 0.34
PPM1B O75688 1/20 0.34
LMNA P02545 1/20 0.34
PPP1CC P36873 1/20 0.34
TFPI2 P48307 1/20 0.34
RAB9A P51151 1/20 0.34
PPP5C P53041 1/20 0.34
PPP1CA P62136 1/20 0.34
PMP22 Q01453 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
TP53 P04637 1/20 0.34
CYP2D6 P10635 1/20 0.34
NFKB1 P19838 1/20 0.34
THPO P40225 1/20 0.34
FNTA P49354 2/20 0.34
PGGT1B P53609 2/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12428071 0.76 KDM4E (0.46) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL1375390 0.76
SCHEMBL22300607 0.76 KDM4E (0.46) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL22300108 0.76 KDM4E (0.46) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL13551917 0.74 FNTA (0.38) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL10738419 0.74 FNTA (0.38) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL10137608 0.74 FNTA (0.38) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL169100 0.74 FNTA (0.38) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL169099 0.74 FNTA (0.38) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL10791612 0.72 FNTA (0.37) KDM4EGMNNPPM1BLMNAPPP1CC

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20040260039-A1 Process for producing organic compound epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained with epoxy resin MITSUI CHEMICALS, INC. (JP) 2004-12-23 US disclosed