⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL216588 | 0.91 | — | — | |
| SCHEMBL291993 | 0.87 | TSHR (0.32) | — | |
| SCHEMBL13935541 | 0.85 | TSHR (0.31) | — | |
| SCHEMBL13935572 | 0.85 | TSHR (0.35) | — | |
| SCHEMBL11759538 | 0.85 | TSHR (0.40) | — | |
| Ethylene Glycol SCHEMBL291992 | 0.83 | PTGS1 (0.32) | — | |
| SCHEMBL29581677 | 0.83 | TSHR (0.39) | — | |
| SCHEMBL5821287 | 0.83 | PPM1B (0.33) | — | |
| SCHEMBL272901 | 0.83 | — | — | |
| SCHEMBL12454158 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20040041280-A1 | Bonding semiconductor to chip carrier; reaction product of epoxide, anhydride and acyclic acetal compound | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2004-03-04 | — | — | US | claimed |
| US-20020171132-A1 | Reworkable and thermally conductive adhesive and use thereof | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2002-11-21 | — | — | US | claimed |
| US-6258899-B1 | Cleavable acetal-containing diepoxide and anhydride curing agent for removable epoxy compositions | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2001-07-10 | — | — | US | claimed |
| US-5879859-A | COMPRISING A CYCLOALIPHATIC DIEPOXIDE AND PHOTOACITVE COMPOUND | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1999-03-09 | — | — | US | claimed |
| US-5560934-A | CURED REACTION PRODUCT CONTAINING A CYCLIC ANHYDRIDE CURING AGENT AND AN AMINE PROMOTER; USED FOR ENCAPSULATING ELECTRONIC CHIPS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1996-10-01 | — | — | US | claimed |
| US-5512613-A | CURED COMPOSITION COMPRISING REACTION PRODUCT OF DIEPOXIDE HAVING ACETAL LINKAGES, CYCLIC DICARBOXYLIC ANHYDRIDE CURING AGENT, 1,3-DIAZA COMPOUND, HYDROXY FUNCTIONAL INITIATOR; REMOVABLE IN ACIDIC SOLVENTS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1996-04-30 | — | — | US | claimed |
| US-11733444-B2 | Method for manufacturing polarizing plate and adhesive composition for polarizing plate | SHANJIN OPTOELECTRONICS (SUZHOU) CO., LTD. | 2023-08-22 | — | — | US | disclosed |
| US-11719869-B2 | Polarizing plate, polarizing plate-carrier film laminate, method for preparing polarizing plate-carrier film laminate, method for preparing polarizing plate, and active energy ray curable composition | SHANJIN OPTOELECTRONICS (SUZHOU) CO., LTD. (CN) | 2023-08-08 | — | — | US | disclosed |
| US-9733511-B2 | Polarizing plate | LG CHEM, LTD. (KR) | 2017-08-15 | — | — | US | disclosed |
| US-9703138-B2 | Polarizing plate | LG CHEM, LTD. (KR) | 2017-07-11 | — | — | US | disclosed |
| US-9638850-B2 | Polarizer, process for preparing the same, optical member and liquid crystal displaying apparatus | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2017-05-02 | — | — | US | disclosed |
| US-9625631-B2 | Optical compensation film, polarizing plate, and liquid crystal display device | Konica Minolta, Inc. (JP) | 2017-04-18 | — | — | US | disclosed |
| US-9581728-B2 | Retardation film, polarizing plate and liquid crystal display | Konica Minolta, Inc. (JP) | 2017-02-28 | — | — | US | disclosed |
| US-20040041280-A1 | Bonding semiconductor to chip carrier; reaction product of epoxide, anhydride and acyclic acetal compound | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2004-03-04 | — | — | US | disclosed |
| US-6617698-B2 | Reworkable and thermally conductive adhesive and use thereof | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2003-09-09 | — | — | US | disclosed |
| US-20020171132-A1 | Reworkable and thermally conductive adhesive and use thereof | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2002-11-21 | — | — | US | disclosed |
| US-5879859-A | COMPRISING A CYCLOALIPHATIC DIEPOXIDE AND PHOTOACITVE COMPOUND | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1999-03-09 | — | — | US | disclosed |
| EP-0532896-B1 | Cleavable diepoxide for removable device protection in electronic packaging | IBM (US) | 1997-03-19 | — | — | EP | disclosed |
| US-5560934-A | CURED REACTION PRODUCT CONTAINING A CYCLIC ANHYDRIDE CURING AGENT AND AN AMINE PROMOTER; USED FOR ENCAPSULATING ELECTRONIC CHIPS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1996-10-01 | — | — | US | disclosed |
| US-5512613-A | CURED COMPOSITION COMPRISING REACTION PRODUCT OF DIEPOXIDE HAVING ACETAL LINKAGES, CYCLIC DICARBOXYLIC ANHYDRIDE CURING AGENT, 1,3-DIAZA COMPOUND, HYDROXY FUNCTIONAL INITIATOR; REMOVABLE IN ACIDIC SOLVENTS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1996-04-30 | — | — | US | disclosed |