SCHEMBL6887364

SCHEMBL6887364

C=CC(C)C#CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6333804 0.73
SCHEMBL20510137 0.73
SCHEMBL10493899 0.71
SCHEMBL3015509 0.69
SCHEMBL836316 0.67
SCHEMBL7410039 0.67
SCHEMBL214876 0.65
SCHEMBL9269603 0.65
SCHEMBL8179763 0.65
SCHEMBL262579 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6749671-B2 Abatement of effluents from chemical vapor deposition processes using organometallic source reagents ADVANCED TECHNOLOGY MATERIALS, INC. 2004-06-15 US disclosed
US-20030136265-A1 Abatement of effluents from chemical vapor deposition processes using organometallic source reagents APPLIED MATERIALS, INC. 2003-07-24 US disclosed
US-6537353-B2 Contacting effluent with sorbent material having sorptive affinity for source reagent and decomposition products thereof to remove residual source reagent and decomposition products ADVANCED TECHNOLOGY MATERIALS, INC. 2003-03-25 US disclosed
CN-1379732-A Abatement of effluents from chemical vapor deposition processes using organome tallicsource reagents ADVANCED TECH MATERIALS (US) 2002-11-13 CN disclosed
EP-1237815-A1 ABATEMENT OF EFFLUENTS FROM CHEMICAL VAPOR DEPOSITION PROCESSES USING ORGANOMETALLICSOURCE REAGENTS ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2002-09-11 EP disclosed
WO-2001028917-A9 ABATEMENT OF EFFLUENTS FROM CHEMICAL VAPOR DEPOSITION PROCESSES USING ORGANOMETALLICSOURCE REAGENTS ADVANCED TECH MATERIALS (US) 2002-08-08 WO disclosed
US-20020094380-A1 Abatement of effluents from chemical vapor deposition processes using organometallicsource reagents ADVANCED TECHNOLOGY MATERIALS, INC. 2002-07-18 US disclosed
US-6391385-B1 USING SOURCE REAGENT HAVING A METAL ORGANIC LOOSELY BOUND TO AN ORGANIC OR ORGANOMETALLIC MOLECULE SUCH THAT UPON EXPOSURE TO HEAT SUCH BOND IS READILY CLEAVABLE ADVANCED TECHNOLOGY MATERIALS, INC. 2002-05-21 US disclosed
WO-2001028917-A1 ABATEMENT OF EFFLUENTS FROM CHEMICAL VAPOR DEPOSITION PROCESSES USING ORGANOMETALLICSOURCE REAGENTS ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2001-04-26 WO disclosed