Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ATM | Q13315 | 1/20 | 0.39 |
| ▸ | TSHR | P16473 | 2/20 | 0.37 |
| ▸ | HPGD | P15428 | 1/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.36 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.36 |
| ▸ | HCAR2 | Q8TDS4 | 4/20 | 0.35 |
| ▸ | MAPT | P10636 | 1/20 | 0.31 |
| ▸ | RAB9A | P51151 | 1/20 | 0.31 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL395317 | 0.88 | ATM (0.39) | ATMTSHRHPGDALDH1A1CYP3A4 | |
| SCHEMBL10626711 | 0.88 | ATM (0.39) | ATMTSHRHPGDALDH1A1CYP3A4 | |
| SCHEMBL64811 | 0.88 | ATM (0.46) | ATMTSHRHPGDALDH1A1CYP3A4 | |
| SCHEMBL3478414 | 0.86 | TSHR (0.52) | ATMTSHRHPGDALDH1A1CYP3A4 | |
| SCHEMBL1632990 | 0.86 | ATM (0.44) | ATMTSHRHPGDALDH1A1CYP3A4 | |
| SCHEMBL8640131 | 0.86 | ATM (0.44) | ATMTSHRHPGDALDH1A1CYP3A4 | |
| SCHEMBL9332257 | 0.84 | ATM (0.43) | ATMTSHRHPGDALDH1A1CYP3A4 | |
| SCHEMBL10839217 | 0.84 | ATM (0.43) | ATMTSHRHPGDALDH1A1CYP3A4 | |
| SCHEMBL15421827 | 0.83 | ATM (0.44) | ATMTSHRHPGDALDH1A1CYP3A4 | |
| SCHEMBL3477474 | 0.82 | TSHR (0.55) | ATMTSHRHPGDALDH1A1CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0802234-B1 | Silicone die attach adhesive and method for fabrication of semiconductor devices | DOW CORNING TORAY SILICONE (JP) | 2004-02-25 | — | — | EP | disclosed |
| EP-0803542-B1 | Electrically conductive silicone elastomer compositions and use for manufacturing semiconductor devices | DOW CORNING TORAY SILICONE (JP) | 2002-09-18 | — | — | EP | disclosed |
| EP-0659817-B1 | Method for the preparation of an acrylic rubber-based composition | NISSIN CHEMICAL IND (JP) | 2001-10-10 | — | — | EP | disclosed |
| EP-0781811-B1 | Curable silicone compositions | DOW CORNING TORAY SILICONE (JP) | 2000-06-14 | — | — | EP | disclosed |
| US-6039831-A | HYDROSILYLATION CURABLE ELECTROCONDUCTIVE SILICONE ELASTOMER HAVING AN ACRYLIC FUNCTIONAL GROUP CONTAINING POLYSILOXANE IS IRRADIATED WITH HIGH BEAM ENERGY TO CURE EXPOSED EDGES, PREVENTING MIGRATION OF LOW MOLECULARWEIGHT SILICONE SPECIES | DOW CORNING TORAY SILICONE CO., LTD. (JP) | 2000-03-21 | — | — | US | disclosed |
| US-5982041-A | Silicone die attach adhesive, method for the fabrication of semiconductor devices, and semiconductor devices | DOW CORNING TORAY SILICONE CO., LTD. (JP) | 1999-11-09 | — | — | US | disclosed |
| US-5872170-A | HYDROSILYLATION CURABLE ELECTRICALLY CONDUCTIVE SILICONE ELASTOMER COMPOSITION CONTAINING AN ACRYLIC FUNCTIONAL GROUP-CONTAINING ORGANOPOLYSILOXANE | DOWN CORNING TORAY SILICONE CO., LTD. (JP) | 1999-02-16 | — | — | US | disclosed |
| US-5789485-A | Curable silicone compositions | DOW CORNING TORAY SILICONE CO., LTD. (JP) | 1998-08-04 | — | — | US | disclosed |
| EP-0803542-A2 | Electrically conductive silicone elastomer compositions and use for manufacturing semiconductor devices | Dow Corning Toray Silicone Company Ltd. (JP) | 1997-10-29 | — | — | EP | disclosed |
| EP-0802234-A2 | Silicone die attach adhesive and method for fabrication of semiconductor devices | Dow Corning Toray Silicone Company, Limited (JP) | 1997-10-22 | — | — | EP | disclosed |
| EP-0781811-A2 | Curable silicone compositions | Dow Corning Toray Silicone Co., Ltd. (JP) | 1997-07-02 | — | — | EP | disclosed |
| US-5585424-A | Acrylic rubber-based composition | NISSIN CHEMICAL INDUSTRY CO., LTD. (JP) | 1996-12-17 | — | — | US | disclosed |
| EP-0659817-A1 | Acrylic rubber-based composition | NISSIN CHEMICAL INDUSTRY CO., LTD. (JP) | 1995-06-28 | — | — | EP | disclosed |
| US-5306558-A | Double-layered rubber laminate | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1994-04-26 | — | — | US | disclosed |
| US-4722975-A | VINYL-CONTAINING ORGANOSILICON ETHYLENICALLY UNSATURATED COMPOUND | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1988-02-02 | — | — | US | disclosed |