Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.65 |
| ▸ | CA12 | O43570 | 2/20 | 0.65 |
| ▸ | CA1 | P00915 | 2/20 | 0.65 |
| ▸ | CA2 | P00918 | 2/20 | 0.65 |
| ▸ | CA3 | P07451 | 2/20 | 0.65 |
| ▸ | CA4 | P22748 | 2/20 | 0.65 |
| ▸ | CA9 | Q16790 | 2/20 | 0.65 |
| ▸ | CA14 | Q9ULX7 | 2/20 | 0.65 |
| ▸ | GLA | P06280 | 1/20 | 0.65 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.58 |
| ▸ | MAOB | P27338 | 3/20 | 0.55 |
| ▸ | TTR | P02766 | 1/20 | 0.54 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.54 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.54 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.54 |
| ▸ | CYP19A1 | P11511 | 2/20 | 0.54 |
| ▸ | MAOA | P21397 | 2/20 | 0.54 |
| ▸ | MEN1 | O00255 | 2/20 | 0.54 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.54 |
| ▸ | MAPT | P10636 | 2/20 | 0.54 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| (Z)-1,2-Diphenylethene SCHEMBL6902531 | 1.00 | TDP1 (0.65) | TDP1CA12CA1CA2CA3 | |
| (Z)-1,2-Diphenylethene SCHEMBL3664388 | 1.00 | TDP1 (0.65) | TDP1CA12CA1CA2CA3 | |
| (Z)-1,2-Diphenylethene SCHEMBL3664391 | 1.00 | TDP1 (0.65) | TDP1CA12CA1CA2CA3 | |
| (Z)-1,2-Diphenylethene SCHEMBL5608393 | 0.94 | MAOB (0.59) | TDP1CA12CA1CA2CA3 | |
| (Z)-1,2-Diphenylethene SCHEMBL5608389 | 0.94 | MAOB (0.59) | TDP1CA12CA1CA2CA3 | |
| (Z)-1,2-Diphenylethene SCHEMBL22230561 | 0.92 | TDP1 (0.55) | TDP1CA12CA1CA2CA3 | |
| (Z)-1,2-Diphenylethene SCHEMBL22230560 | 0.92 | TDP1 (0.55) | TDP1CA12CA1CA2CA3 | |
| (E)-4-Styrylphenol SCHEMBL716721 | 0.92 | APP (0.61) | TDP1CA12CA1CA2CA3 | |
| (E)-4-Styrylphenol SCHEMBL27993 | 0.92 | APP (0.61) | TDP1CA12CA1CA2CA3 | |
| SCHEMBL14038171 | 0.92 | APP (0.61) | TDP1CA12CA1CA2CA3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5939509-A | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LTD. (JP) | 1999-08-17 | — | — | US | claimed |
| EP-0739877-B1 | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL CO (JP) | 1999-08-04 | — | — | EP | claimed |
| EP-0739877-A2 | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY LIMITED (JP) | 1996-10-30 | — | — | EP | claimed |
| EP-0869148-B1 | Epoxy resin composition and method for producing the same | SUMITOMO CHEMICAL CO (JP) | 2004-03-03 | — | — | EP | disclosed |
| US-6255409-B1 | EPOXY RESIN COMPOSITION COMPRISING BIFUNCTIONAL CRYSTALLINE EPOXY COMPOUND, AMORPHOUS TRISPHENOLMETHANE TYPE EPOXY COMPOUND HAVING THREE OR MORE EPOXY GROUPS IN MOLECULE, AND EPOXY CURING AGENT HAVING PHENOLIC HYDROXYL GROUPS | SUMITOMO CHEMICAL CO., LTD. (JP) | 2001-07-03 | — | — | US | disclosed |
| US-5969060-A | MIXING WITH CONTROLLED HEATING BETWEEN MELTING POINT OF CRYSTALLINE EPOXY RESIN AND SOFTENING POINT OF AMORPHOUS EPOXY RESIN YIELDS UNIFORM DISPERSION, FOR PAINTS, ADHESIVES, ENCAPSULATION OF SEMICONDUCTORS | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1999-10-19 | — | — | US | disclosed |
| EP-0943639-A2 | Epoxy resin composition and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1999-09-22 | — | — | EP | disclosed |
| US-5939509-A | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LTD. (JP) | 1999-08-17 | — | — | US | disclosed |
| US-5939473-A | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1999-08-17 | — | — | US | disclosed |
| EP-0739877-B1 | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL CO (JP) | 1999-08-04 | — | — | EP | disclosed |
| EP-0869148-A1 | Epoxy resin composition and method for producing the same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-10-07 | — | — | EP | disclosed |
| CN-1145353-A | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL CO (JP) | 1997-03-19 | — | — | CN | disclosed |
| EP-0739877-A2 | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY LIMITED (JP) | 1996-10-30 | — | — | EP | disclosed |
| US-4101601-A | Epoxy-catalyst additive system to produce higher I.V. polybutylene terephthalate from low I.V. polymer | CELANESE CORPORATION (US) | 1978-07-18 | — | — | US | disclosed |
| US-4071503-A | THERMOPLASTIC POLYESTERS | CELANESE CORPORATION (US) | 1978-01-31 | — | — | US | disclosed |