SCHEMBL6904516

SCHEMBL6904516

CCCCCCCCCCCCCOC(=O)C=CC(=O)O.CCCC[Sn]CCCC

nearest known ligand 0.81

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
HCAR2 Q8TDS4 5/20 0.81
ATM Q13315 1/20 0.58
PRKCA P17252 2/20 0.46
MAPT P10636 2/20 0.45
RAB9A P51151 1/20 0.45
NPSR1 Q6W5P4 1/20 0.45
APP P05067 3/20 0.44
NAAA Q02083 1/20 0.43
SMN1; SMN2 Q16637 2/20 0.42
KDM4E B2RXH2 1/20 0.42
ALDH1A1 P00352 1/20 0.42
LMNA P02545 1/20 0.42
L3MBTL1 Q9Y468 1/20 0.42
HPGD P15428 1/20 0.42
TSHR P16473 1/20 0.42
HTT P42858 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hexyl Fumarate SCHEMBL11599810 1.00 HCAR2 (0.81) HCAR2ATMPRKCAMAPTRAB9A
SCHEMBL27680539 1.00 HCAR2 (0.81) HCAR2ATMPRKCAMAPTRAB9A
Hexyl Fumarate SCHEMBL11599799 1.00 HCAR2 (0.81) HCAR2ATMPRKCAMAPTRAB9A
Butyl Fumarate SCHEMBL10749413 0.94 HCAR2 (0.80) HCAR2ATMPRKCAMAPTRAB9A
Butyl Fumarate SCHEMBL10749406 0.94 HCAR2 (0.80) HCAR2ATMPRKCAMAPTRAB9A
SCHEMBL1361701 0.94 HCAR2 (0.69) HCAR2ATMPRKCAMAPTRAB9A
SCHEMBL10859921 0.94 HCAR2 (0.69) HCAR2ATMPRKCAMAPTRAB9A
SCHEMBL394039 0.94 HCAR2 (0.69) HCAR2ATMPRKCAMAPTRAB9A
SCHEMBL1361703 0.94 HCAR2 (0.69) HCAR2ATMPRKCAMAPTRAB9A
SCHEMBL10859931 0.94 HCAR2 (0.69) HCAR2ATMPRKCAMAPTRAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1134251-B1 Primer composition and method of bonding a sealing material onto a substrate KANEKA CORP (JP) 2004-10-20 EP disclosed
US-6576082-B2 Modified addition polymer; bonding a sealing coating KANEKA CORPORATION (JP) 2003-06-10 US disclosed
US-20010031315-A1 Primer composition and bonding method KANEKA CORPORATION (JP) 2001-10-18 US disclosed
EP-1134251-A1 Primer composition Kaneka Corporation (JP) 2001-09-19 EP disclosed