SCHEMBL6914203

SCHEMBL6914203

Cc1ccc(S(=O)(=O)C(Cl)c2ccccc2)cc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPY2R P49146 1/20 0.50
CA12 O43570 4/20 0.46
CA9 Q16790 4/20 0.46
CA1 P00915 2/20 0.46
CA2 P00918 2/20 0.46
CYP2D6 P10635 3/20 0.45
MAPK1 P28482 1/20 0.45
GAA P10253 4/20 0.45
SMN1; SMN2 Q16637 3/20 0.44
HTT P42858 1/20 0.44
ALDH1A1 P00352 4/20 0.43
CYP1A2 P05177 3/20 0.43
CYP3A4 P08684 3/20 0.43
CYP2C9 P11712 2/20 0.43
CYP2C19 P33261 2/20 0.43
KDM4E B2RXH2 2/20 0.43
TDP1 Q9NUW8 2/20 0.43
HPGD P15428 1/20 0.43
ALOX12 P18054 1/20 0.43
GFER P55789 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL754520 0.81 NPY2R (0.50) NPY2RCA12CA9CA1CA2
SCHEMBL11689700 0.81 NPY2R (0.50) NPY2RCA12CA9CA1CA2
SCHEMBL12373175 0.81 NPY2R (0.50) NPY2RCA12CA9CA1CA2
SCHEMBL29597999 0.80 NPY2R (0.47) NPY2RCA12CA9CA1CA2
SCHEMBL4830292 0.79 NPY2R (0.49) NPY2RCA12CA9CA1CA2
SCHEMBL6543930 0.78 GAA (0.50) NPY2RCA12CA9CA1CA2
SCHEMBL5776454 0.77 MEN1 (0.51) NPY2RCA12CA9CA1CA2
SCHEMBL7821908 0.77 SRC (0.55) NPY2RCA12CA9CA1CA2
SCHEMBL14410815 0.77 NPY2R (0.47) NPY2RCA12CA9CA1CA2
SCHEMBL13848475 0.77 NPY2R (0.47) NPY2RCA12CA9CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6727294-B2 RADIATION TRANSPARENT MOLDING MATERIALS MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2004-04-27 US disclosed
US-20010034419-A1 Radiation transparent molding materials MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2001-10-25 US disclosed