⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28347873 | 0.96 | — | — | |
| SCHEMBL27833853 | 0.96 | — | — | |
| SCHEMBL23918 | 0.95 | — | — | |
| Ammonia Solution, Strong SCHEMBL28278526 | 0.91 | — | — | |
| SCHEMBL28164211 | 0.91 | — | — | |
| SCHEMBL27836639 | 0.91 | — | — | |
| SCHEMBL16228233 | 0.91 | — | — | |
| SCHEMBL28050457 | 0.91 | — | — | |
| SCHEMBL20553823 | 0.91 | — | — | |
| SCHEMBL25421843 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-102964143-B | Method for preparing foamed ceramic insulation board by waste glass ceramic wafer | ANSHENG SCIENCE & TECH DEP CO LTD | 2014-08-13 | — | — | CN | claimed |
| CN-102964143-B | Method for preparing foamed ceramic insulation board by waste glass ceramic wafer | ANSHENG SCIENCE & TECH DEP CO LTD | 2014-08-13 | — | — | CN | disclosed |
| CN-102964143-A | Method for preparing foamed ceramic insulation board by waste glass ceramic wafer | ANSHENG SCIENCE & TECH DEP CO LTD | 2013-03-13 | — | — | CN | disclosed |
| US-6579747-B1 | Method of making electronics package with specific areas having low coefficient of thermal expansion | NUVENTIX, INC. | 2003-06-17 | — | — | US | disclosed |
| US-6566743-B1 | Heat pipe system for removing heat from semiconductor chips and packages. | THERMAL CORP. | 2003-05-20 | — | — | US | disclosed |
| US-6333551-B1 | Surface profiling in electronic packages for reducing thermally induced interfacial stresses | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2001-12-25 | — | — | US | disclosed |