SCHEMBL695258

SCHEMBL695258

CC1CCOC(=O)OCC1

nearest known ligand 0.39

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.33
CA9 Q16790 1/20 0.33
CYP1A2 P05177 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
ALDH1A1 P00352 1/20 0.32
LMNA P02545 1/20 0.32
TP53 P04637 1/20 0.32
TSHR P16473 1/20 0.32
CRBN Q96SW2 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethylene Glycol SCHEMBL1873037 0.89 CYP1A2 (0.32) CYP1A2
SCHEMBL337623 0.87
SCHEMBL19610800 0.79
SCHEMBL6447862 0.77
SCHEMBL320614 0.77
SCHEMBL16974673 0.77
SCHEMBL27812727 0.75 TLR4 (0.31)
SCHEMBL1867958 0.75 CA1 (0.58) CA1CA9CYP1A2SMN1; SMN2ALDH1A1
SCHEMBL8654222 0.74
SCHEMBL29146078 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 341 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250382742-A1 NAPPED ARTIFICIAL LEATHER AND MANUFACTURING METHOD THEREFOR KURARAY CO., LTD. (JP) 2025-12-18 US disclosed
EP-4660275-A1 CURABLE HEAT-CONDUCTIVE ADHESIVE AGENT Sekisui Chemical Co., Ltd. (JP) 2025-12-10 EP disclosed
EP-4660273-A1 CURABLE THERMALLY CONDUCTIVE ADHESIVE AND THERMALLY CONDUCTIVE MEMBER Sekisui Chemical Co., Ltd. (JP) 2025-12-10 EP disclosed
EP-4660272-A1 CURABLE THERMALLY CONDUCTIVE ADHESIVE, THERMALLY CONDUCTIVE MEMBER, AND BATTERY ASSEMBLY Sekisui Chemical Co., Ltd. (JP) 2025-12-10 EP disclosed
US-12312740-B2 Grain-finished leather-like sheet KURARAY CO., LTD. (JP) 2025-05-27 US disclosed
EP-4553219-A1 NAPPED ARTIFICIAL LEATHER AND MANUFACTURING METHOD THEREFOR Kuraray Co., Ltd. (JP) 2025-05-14 EP disclosed
CN-119795704-A Release film 三菱化学株式会社 2025-04-11 CN disclosed
CN-119717431-A Electrophotographic member, process cartridge, and electrophotographic image forming apparatus 佳能株式会社 2025-03-28 CN disclosed
CN-114714731-B Laminated white film and recorded material 三菱化学株式会社 2025-03-18 CN disclosed
CN-119630724-A Thermosetting resin composition, cured product, and flexible printed board 株式会社力森诺科 2025-03-14 CN disclosed
EP-1194386-A2 RADIATION CURABLE RESIN COMPOSITION DSM N.V. (NL) 2002-04-10 EP disclosed
WO-2001077040-A2 COATED OPTICAL FIBER AND ADIATION CURABLE RESIN COMPOSITION DSM N.V. (NL) 2001-10-18 WO disclosed
EP-1142912-A1 Radiation curable compositions DSM N.V. (NL) 2001-10-10 EP disclosed
US-20010020049-A1 Liquid curable resin composition JSR CORPORATION (JP) 2001-09-06 US disclosed
WO-2001005724-A2 RADIATION CURABLE RESIN COMPOSITION DSM N.V. (NL) 2001-01-25 WO disclosed
EP-1070682-A1 Radiation curable resin composition DSM N.V. (NL) 2001-01-24 EP disclosed
WO-2000022022-A1 PHOTO CURABLE RESIN COMPOSITION FOR TENSION MEMBERS DSM N.V. (NL) 2000-04-20 WO disclosed
US-5914206-A RESIN BLACK MATRIX HAS A 20.DEGREE. SPECULAR GLOSSINESS OF FROM 100 TO 200. MITSUBISHI CHEMICAL CORPORATION (JP) 1999-06-22 US disclosed
WO-1999018043-A1 OPTICAL FIBER COATINGS DSM N.V. (NL) 1999-04-15 WO disclosed
EP-0816899-A2 Color filter and black resist composition MITSUBISHI CHEMICAL CORPORATION (JP) 1998-01-07 EP disclosed