SCHEMBL6969625

SCHEMBL6969625

c1ccc2c(c1)ncn2CC1CO1

nearest known ligand 0.59

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.58
CYP11B1 P15538 6/20 0.54
CYP11B2 P19099 6/20 0.54
TNF P01375 2/20 0.51
HTT P42858 5/20 0.51
LMNA P02545 4/20 0.51
TSHR P16473 1/20 0.51
NPSR1 Q6W5P4 1/20 0.51
SMN1; SMN2 Q16637 3/20 0.49
MAPK1 P28482 2/20 0.48
MEN1 O00255 1/20 0.48
KMT2A Q03164 1/20 0.48
EGLN3 Q9H6Z9 1/20 0.46
L3MBTL1 Q9Y468 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23499140 0.87 TDP1 (0.54) TDP1CYP11B1CYP11B2TNFHTT
SCHEMBL29668645 0.87 TDP1 (0.54) TDP1CYP11B1CYP11B2TNFHTT
SCHEMBL3733050 0.83 TSHR (0.52) TDP1CYP11B1CYP11B2TNFHTT
SCHEMBL30697347 0.82 HTT (0.55) TDP1CYP11B1CYP11B2TNFHTT
SCHEMBL30497370 0.80 CYP11B1 (0.51) TDP1CYP11B1CYP11B2TNFHTT
SCHEMBL5884617 0.80 CYP11B1 (0.48) TDP1CYP11B1CYP11B2TNFHTT
SCHEMBL16404602 0.79 HTT (0.62) TDP1CYP11B1CYP11B2TNFHTT
SCHEMBL13952314 0.79 TDP1 (0.61) TDP1CYP11B1CYP11B2TNFHTT
SCHEMBL30497354 0.77 CYP11B1 (0.48) TDP1CYP11B1CYP11B2TNFHTT
SCHEMBL21883050 0.77 HTT (0.72) TDP1CYP11B1CYP11B2TNFHTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10633755-B2 Copper plating bath composition and method for deposition of copper ATOTECH DEUTSCHLAND GMBH (DE) 2020-04-28 US claimed
US-20180237932-A1 COPPER PLATING BATH COMPOSITION AND METHOD FOR DEPOSITION OF COPPER ATOTECH USA, LLC 2018-08-23 US claimed
EP-3141633-B1 COPPER PLATING BATH COMPOSITION ATOTECH DEUTSCHLAND GMBH (DE) 2018-05-02 EP claimed
EP-3141633-A1 COPPER PLATING BATH COMPOSITION ATOTECH Deutschland GmbH (DE) 2017-03-15 EP claimed
US-10633755-B2 Copper plating bath composition and method for deposition of copper ATOTECH DEUTSCHLAND GMBH (DE) 2020-04-28 US disclosed
US-20180237932-A1 COPPER PLATING BATH COMPOSITION AND METHOD FOR DEPOSITION OF COPPER ATOTECH USA, LLC 2018-08-23 US disclosed
EP-3141633-B1 COPPER PLATING BATH COMPOSITION ATOTECH DEUTSCHLAND GMBH (DE) 2018-05-02 EP disclosed
EP-3141633-A1 COPPER PLATING BATH COMPOSITION ATOTECH Deutschland GmbH (DE) 2017-03-15 EP disclosed
EP-0775118-B1 BENZIMIDAZOLE DERIVATIVES HAVING DOPAMINERGIC ACTIVITY PFIZER (US) 2003-06-04 EP disclosed
US-5889010-A PSYCHOLOGICAL DISORDERS; UROGENITAL DISORDERS; COGNITION ACTIVATORS; NERVOUS SYSTEM DISORDERS; VISION DEFECTS; CONGESTIVE HEART FAILURE; DRUG ABRUSE; PARKINSON'S DISEASE;ANTIINFLAMMATORY AGENTS; ANTIALLERGENS PFIZER INC. (US) 1999-03-30 US disclosed
EP-0775118-A1 BENZIMIDAZOLE DERIVATIVES HAVING DOPAMINERGIC ACTIVITY PFIZER INC. (US) 1997-05-28 EP disclosed
WO-1996004250-A1 BENZIMIDAZOLE DERIVATIVES HAVING DOPAMINERGIC ACTIVITY PFIZER INC. (US) 1996-02-15 WO disclosed
US-5147750-A Amino group containing polymers; narrow electrostatic charge distribution SANYO CHEMICAL INDUSTRIES, LTD. (JP) 1992-09-15 US disclosed