SCHEMBL701612

SCHEMBL701612

CC(C)(C)C1C2CC3CC(C2)C(C(C)(C)C)C1C3

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4067305 0.80 CYP2C9 (0.38)
SCHEMBL11453618 0.74 CYP2C9 (0.33)
SCHEMBL19217890 0.67
SCHEMBL26370610 0.65 CYP2C9 (0.35)
SCHEMBL22073526 0.65 CYP2C9 (0.35)
SCHEMBL25630117 0.65 CYP2C9 (0.35)
SCHEMBL3282039 0.65 CYP2C9 (0.35)
SCHEMBL6456147 0.65 CYP2C9 (0.41)
SCHEMBL26364080 0.65 CYP2C9 (0.35)
SCHEMBL24385264 0.64

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105683154-B Cyanate ester compound, curable resin composition containing the same, and cured product thereof 三菱瓦斯化学株式会社 2018-03-16 CN disclosed
CN-105683154-A Cyanate ester compound, curable resin composition containing the same, and cured product thereof 三菱瓦斯化学株式会社 2016-06-15 CN disclosed
US-8802348-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2014-08-12 US disclosed
US-8377627-B2 Compound and radiation-sensitive composition JSR CORPORATION (JP) 2013-02-19 US disclosed
EP-1961739-B1 NOVEL COMPOUND, POLYMER, AND RESIN COMPOSITION JSR CORP (JP) 2012-10-17 EP disclosed
US-8273837-B2 Compound, polymer, and resin composition JSR CORPORATION (JP) 2012-09-25 US disclosed
US-20120164586-A1 PATERN FORMING METHOD JSR CORPORATION (JP) 2012-06-28 US disclosed
US-8182977-B2 Polymer and positive-tone radiation-sensitive resin composition JSR CORPORATION (JP) 2012-05-22 US disclosed
US-8124314-B2 Radiation-sensitive composition JSR CORPORATION (JP) 2012-02-28 US disclosed
US-8084188-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2011-12-27 US disclosed
US-7452655-B2 Acrylic copolymer and radiation-sensitive resin composition JSR CORPORATION (JP) 2008-11-18 US disclosed
EP-1961739-A1 NOVEL COMPOUND, POLYMER, AND RESIN COMPOSITION JSR Corporation (JP) 2008-08-27 EP disclosed
EP-1953595-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2008-08-06 EP disclosed
US-20070148585-A1 Hyperbranched polymer, production method therefor and resist composition containing hyperbranched polymer LION CORPORATION. 2007-06-28 US disclosed
EP-1698645-A1 HYPERBRANCHED POLYMER, PROCESS FOR PRODUCING THE SAME AND RESIST COMPOSITION CONTAINING THE HYPERBRANCHED POLYMER Lion Corporation (JP) 2006-09-06 EP disclosed
US-20060074139-A1 Acrylic copolymer and radiation-sensitive resin composition JSR CORPORATION (JP) 2006-04-06 US disclosed
EP-1586594-A1 ACRYLIC COPOLYMER AND RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2005-10-19 EP disclosed
US-6403280-B1 TERPOLYMER COMPRISING MALEIC ANHYDRIDE, NORBORNENE ESTER DERIVATIVE, AND ALICYCLIC (METH)ACRYLATE MONOMERS; DURABILITY TO DRY ETCHING; TRANSPARENCY, STORAGE STABILITY JSR CORPORATION (JP) 2002-06-11 US disclosed
CN-1332205-A Radiation-sensitive resin composition JSR CORP (JP) 2002-01-23 CN disclosed
EP-1048983-A1 Radiation sensitive resin composition JSR Corporation (JP) 2000-11-02 EP disclosed