SCHEMBL704444

SCHEMBL704444

CCCCCCC(O[SiH3])c1ccccc1

nearest known ligand 0.43

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
CYP19A1 P11511 3/20 0.43
HTR2A P28223 1/20 0.41
SLC7A5 Q01650 2/20 0.41
CSNK1E P49674 1/20 0.41
ALDH1A1 P00352 1/20 0.40
OPRM1 P35372 1/20 0.40
OPRD1 P41143 1/20 0.40
OPRK1 P41145 1/20 0.40
OPRL1 P41146 1/20 0.40
NAAA Q02083 2/20 0.40
SIGMAR1 Q99720 1/20 0.40
NPC1 O15118 1/20 0.38
RAB9A P51151 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
KCNH2 Q12809 2/20 0.38
ASAH1 Q13510 1/20 0.38
PRSS1 P07477 1/20 0.38
PRSS2 P07478 1/20 0.38
PRSS3 P35030 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL706088 1.00 CYP19A1 (0.43) CYP19A1HTR2ASLC7A5CSNK1EALDH1A1
SCHEMBL702729 0.98 SLC7A5 (0.42) CYP19A1HTR2ASLC7A5CSNK1EALDH1A1
SCHEMBL703009 0.93 POLB (0.41) CYP19A1SLC7A5ALDH1A1OPRM1OPRD1
SCHEMBL29002040 0.85 HTR2A (0.44) CYP19A1HTR2ASLC7A5CSNK1EALDH1A1
SCHEMBL9168419 0.85 HTR2A (0.44) CYP19A1HTR2ASLC7A5CSNK1EALDH1A1
SCHEMBL3219880 0.85 HTR2A (0.44) CYP19A1HTR2ASLC7A5CSNK1EALDH1A1
SCHEMBL11005389 0.85 HTR2A (0.44) CYP19A1HTR2ASLC7A5CSNK1EALDH1A1
SCHEMBL16057441 0.85 HTR2A (0.44) CYP19A1HTR2ASLC7A5CSNK1EALDH1A1
SCHEMBL8048483 0.85 HTR2A (0.44) CYP19A1HTR2ASLC7A5CSNK1EALDH1A1
SCHEMBL7448877 0.85 HTR2A (0.44) CYP19A1HTR2ASLC7A5CSNK1EALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2128897-B1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LTD (JP) 2015-05-06 EP disclosed
US-8716209-B2 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device FUJITSU LIMITED (JP) 2014-05-06 US disclosed
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed