⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3239121 | 0.97 | — | — | |
| SCHEMBL3237907 | 0.97 | — | — | |
| SCHEMBL3243281 | 0.97 | — | — | |
| SCHEMBL3239917 | 0.97 | — | — | |
| SCHEMBL702535 | 0.94 | — | — | |
| SCHEMBL8852072 | 0.92 | TSHR (0.33) | — | |
| SCHEMBL5574671 | 0.90 | TSHR (0.38) | — | |
| SCHEMBL8852039 | 0.90 | TSHR (0.38) | — | |
| SCHEMBL4735088 | 0.90 | TSHR (0.38) | — | |
| SCHEMBL5572064 | 0.90 | TSHR (0.38) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9481676-B2 | Azepino[4,5-B]indoles and methods of use | MEDIVATION TECHNOLOGIES, INC. (US) | 2016-11-01 | — | — | US | disclosed |
| US-9409910-B2 | Azepino[4,5-B]indoles and methods of use | MEDIVATION TECHNOLOGIES, INC. (US) | 2016-08-09 | — | — | US | disclosed |
| US-20140213577-A1 | AZEPINO[4,5-B]INDOLES AND METHODS OF USE | MEDIVATION TECHNOLOGIES, INC. (US) | 2014-07-31 | — | — | US | disclosed |
| US-20140088087-A1 | AZEPINO[4,5-B]INDOLES AND METHODS OF USE | MEDIVATION TECHNOLOGIES, INC. (US) | 2014-03-27 | — | — | US | disclosed |
| US-8569287-B2 | Azepino[4,5-B]indoles and methods of use | MEDIVATION TECHNOLOGIES, INC. (US) | 2013-10-29 | — | — | US | disclosed |
| US-20130190295-A1 | AZEPINO[4,5-B]INDOLES AND METHODS OF USE | MEDIVATION TECHNOLOGIES, INC. (US) | 2013-07-25 | — | — | US | disclosed |
| EP-2610220-A1 | DISPERSION IN HYDROPHOBIC ORGANIC SOLVENT OF SURFACE-MODIFIED COLLOIDAL PARTICLES OF ANHYDROUS ZINC ANTIMONATE, COATING COMPOSITION CONTAINING SAME, AND COATED MEMBER | Nissan Chemical Industries, Ltd. (JP) | 2013-07-03 | — | — | EP | disclosed |
| US-20130143035-A1 | HYDROPHOBIC-ORGANIC-SOLVENT DISPERSION OF SURFACE-MODIFIED COLLOIDAL PARTICLES OF ANHYDROUS ZINC ANTIMONATE, COATING COMPOSITION CONTAINING THE SAME, AND COATED MEMBER | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2013-06-06 | — | — | US | disclosed |
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| US-20100152163-A1 | AZEPINO[4,5-B]INDOLES AND METHODS OF USE | MEDIVATION TECHNOLOGIES, INC. | 2010-06-17 | — | — | US | disclosed |
| EP-2163664-A1 | Method for depositing si-containing film, insulator film, and semiconductor device | Shin-Etsu Chemical Co., Ltd. (JP) | 2010-03-17 | — | — | EP | disclosed |
| US-20100061915-A1 | METHOD FOR DEPOSITING SI-CONTAINING FILM, INSULATOR FILM, AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-03-11 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |