⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14161868 | 0.70 | — | — | |
| SCHEMBL17319583 | 0.70 | — | — | |
| SCHEMBL9457114 | 0.67 | — | — | |
| SCHEMBL8630102 | 0.67 | — | — | |
| SCHEMBL15363577 | 0.63 | — | — | |
| SCHEMBL618901 | 0.63 | — | — | |
| SCHEMBL4877931 | 0.63 | — | — | |
| SCHEMBL11159118 | 0.63 | — | — | |
| SCHEMBL491178 | 0.63 | — | — | |
| SCHEMBL23673185 | 0.60 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-3970532-A | 2-Hydroxyethylphosphines | BORG-WARNER CORPORATION (US) | 1976-07-20 | — | — | US | claimed |
| CN-100457823-C | Epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained thereof | MITSUI CHEMICALS INC (JP) | 2009-02-04 | — | — | CN | disclosed |
| CN-1285636-C | Process for producing oxyalkylene derivative | MITSUI CHEMICALS INC (JP) | 2006-11-22 | — | — | CN | disclosed |
| CN-1781985-A | Epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained thereof | MITSUI CHEMICALS INC (JP) | 2006-06-07 | — | — | CN | disclosed |
| CN-1592764-A | Method for producing organic compound, epoxy resin composition, cured product of the epoxy resin, and semiconductor device formed using the epoxy resin | MITSUI CHEMICALS INC (JP) | 2005-03-09 | — | — | CN | disclosed |
| US-20040260039-A1 | Process for producing organic compound epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained with epoxy resin | MITSUI CHEMICALS, INC. (JP) | 2004-12-23 | — | — | US | disclosed |