Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 4/20 | 0.42 |
| ▸ | THRB | P10828 | 1/20 | 0.42 |
| ▸ | DNM1 | Q05193 | 6/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.33 |
| ▸ | LMNA | P02545 | 3/20 | 0.33 |
| ▸ | MEN1 | O00255 | 2/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.33 |
| ▸ | SLC22A1 | O15245 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18804467 | 1.00 | TSHR (0.42) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL7055968 | 1.00 | TSHR (0.42) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL27993585 | 1.00 | TSHR (0.42) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL4971685 | 1.00 | TSHR (0.42) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL10431307 | 0.97 | — | — | |
| SCHEMBL3482093 | 0.89 | — | — | |
| SCHEMBL8322880 | 0.81 | TSHR (0.44) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL8180002 | 0.81 | TSHR (0.44) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL16938057 | 0.81 | TSHR (0.44) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL12209689 | 0.81 | TSHR (0.44) | TSHRTHRBDNM1ALDH1A1LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12473474-B2 | Addition curable silicone adhesive compositions | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2025-11-18 | — | — | US | disclosed |
| US-11952516-B2 | Addition curable silicone adhesive compositions | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2024-04-09 | — | — | US | disclosed |
| CN-113518794-B | Addition-curable silicone adhesive composition | 迈图高新材料公司 | 2023-12-22 | — | — | CN | disclosed |
| US-20230047848-A1 | ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS | MOMENTIVE PERFORMANCE MATERIALS INC. | 2023-02-16 | — | — | US | disclosed |
| EP-4073193-A1 | ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS | Momentive Performance Materials Inc. (US) | 2022-10-19 | — | — | EP | disclosed |
| CN-115066475-A | Addition curable silicone adhesive composition | 迈图高新材料公司 | 2022-09-16 | — | — | CN | disclosed |
| US-20220119690-A1 | ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS | MOMENTIVE PERFORMANCE MATERIALS INC. | 2022-04-21 | — | — | US | disclosed |
| EP-3914638-A1 | ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS | Momentive Performance Materials Inc. (US) | 2021-12-01 | — | — | EP | disclosed |
| WO-2021118582-A1 | ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2021-06-17 | — | — | WO | disclosed |
| WO-2020153947-A1 | ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2020-07-30 | — | — | WO | disclosed |
| CN-101196700-A | Hydrophobic metallic oxide powder, producing method and toner composition for electrophotograph | EVONIK DEGUSSA GMBH (DE) | 2008-06-11 | — | — | CN | disclosed |
| EP-1006118-B1 | Method for synthesizing organosilicon compounds that contain a group bonded to silicon across the SI-C bond | DOW CORNING ASIA LTD (JP) | 2003-05-07 | — | — | EP | disclosed |
| US-6191220-B1 | REACTING POLYMER HAVING OLEFINIC OR ACETYLENIC UNSATURATED GROUPS WITH HYDRIDE (HYDROCARBONOXY) SILANE IN PRESENCE OF PLATINUM OR PLATINUM COMPOUND CATALYST AND SILYLATED CARBOXYLIC ACID TO FORM HYDROCARBONOXYSILYL FUNCTIONAL POLYMER | DOW CORNING ASIA, LTD. (JP) | 2001-02-20 | — | — | US | disclosed |
| US-6111126-A | Method for synthesizing organosilicon compounds that contain a functional group bonded to silicon across the Si-C bond | DOW CORNING ASIA, LTD. (JP) | 2000-08-29 | — | — | US | disclosed |
| EP-1006118-A2 | Method for synthesizing organosilicon compounds that contain a group bonded to silicon across the SI-C bond | Dow Corning Asia, Ltd. (JP) | 2000-06-07 | — | — | EP | disclosed |
| US-6048994-A | Selective hydrosilylation method using hydrido (hydrocarbonoxy) silane | DOW CORNING ASIA, LTD. (JP) | 2000-04-11 | — | — | US | disclosed |
| US-5994573-A | Method for making triarylamine compounds having hydrocarbonoxysilyl groups | DOW CORNING ASIA, LTD. (JP) | 1999-11-30 | — | — | US | disclosed |
| US-5986124-A | Method for making compounds containing hydrocarbonoxysilyi groups by hydrosilylation using hydrido (hydrocarbonoxy) silane compounds | DOW CORNING ASIA, LTD. (JP) | 1999-11-16 | — | — | US | disclosed |