⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Methylamine SCHEMBL3101711 | 0.94 | — | — | |
| SCHEMBL9767480 | 0.90 | — | — | |
| SCHEMBL9989016 | 0.87 | TSHR (0.50) | — | |
| SCHEMBL15091720 | 0.87 | TSHR (0.50) | — | |
| SCHEMBL9989758 | 0.87 | TSHR (0.50) | — | |
| SCHEMBL9989021 | 0.87 | TSHR (0.50) | — | |
| SCHEMBL9989753 | 0.87 | TSHR (0.50) | — | |
| SCHEMBL15303910 | 0.79 | TSHR (0.40) | — | |
| SCHEMBL706176 | 0.77 | — | — | |
| SCHEMBL23701288 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024061483-A1 | NOVEL MINIGASTRIN-DERIVED CHOLECYSTOKININ 2 RECEPTOR BINDING MOLECULES FOR IMAGING AND TARGETED RADIOTHERAPY | Technische Universität München (DE) | 2024-03-28 | — | — | WO | disclosed |
| WO-2024023332-A1 | SILICON-BASED FLUORIDE ACCEPTOR GROUPS FOR RADIOPHARMACEUTICALS | Technische Universität München (DE) | 2024-02-01 | — | — | WO | disclosed |
| EP-3917581-A1 | SILICON-FLUORIDE ACCEPTOR SUBSTITUTED RADIOPHARMACEUTICALS AND PRECURSORS THEREOF | Technische Universität München (DE) | 2021-12-08 | — | — | EP | disclosed |
| WO-2020157128-A1 | SILICON-FLUORIDE ACCEPTOR SUBSTITUTED RADIOPHARMACEUTICALS AND PRECURSORS THEREOF | Technische Universität München (DE) | 2020-08-06 | — | — | WO | disclosed |
| US-8791221-B2 | Addition-curable metallosiloxane compound | DAICEL CORPORATION (JP) | 2014-07-29 | — | — | US | disclosed |
| EP-2661284-A1 | HER2 BINDING PEPTIDES LABELLED WITH A 18F - CONTAINING ORGANOSILICON COMPOUND | GE Healthcare UK Limited (GB) | 2013-11-13 | — | — | EP | disclosed |
| EP-2654804-A1 | HER2 BINDING PEPTIDES LABELED WITH ALUMINIUM-[18]FLUORIDE COMPLEXED BY NOTA | GE Healthcare UK Limited (GB) | 2013-10-30 | — | — | EP | disclosed |
| EP-2650319-A1 | ADDITION-CURABLE METALLOSILOXANE COMPOUND | Daicel Corporation (JP) | 2013-10-16 | — | — | EP | disclosed |
| US-20130267653-A1 | ADDITION-CURABLE METALLOSILOXANE COMPOUND | DAICEL CORPORATION (JP) | 2013-10-10 | — | — | US | disclosed |
| WO-2012087908-A1 | HER2 BINDING PEPTIDES LABELED WITH ALUMINIUM-[18] FLUORIDE COMPLEXED BY NOTA | GE HEALTHCARE LIMITED (GB) | 2012-06-28 | — | — | WO | disclosed |
| WO-2012087912-A1 | HER2 BINDING PEPTIDES LABELLED WITH A 18F - CONTAINING ORGANOSILICON COMPOUND | GE HEALTHCARE LIMITED (GB) | 2012-06-28 | — | — | WO | disclosed |
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |