⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28083650 | 1.00 | — | — | |
| Hydrochloric Acid SCHEMBL6849658 | 0.98 | — | — | |
| SCHEMBL70323 | 0.98 | — | — | |
| SCHEMBL28940458 | 0.95 | — | — | |
| SCHEMBL28284525 | 0.95 | — | — | |
| SCHEMBL29001779 | 0.95 | — | — | |
| SCHEMBL6931939 | 0.95 | — | — | |
| SCHEMBL27757248 | 0.95 | — | — | |
| SCHEMBL28685092 | 0.91 | — | — | |
| SCHEMBL20531228 | 0.80 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 327 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115109562-B | Double-component high-heat-dissipation high-conductivity organic silicon pouring sealant and preparation method thereof | 广州白云科技股份有限公司 | 2024-03-12 | — | — | CN | claimed |
| CN-117487169-A | End capping agent, preparation method thereof and application of end capping agent in silicone rubber sealant | 北京天山新材料技术有限公司 | 2024-02-02 | — | — | CN | claimed |
| CN-113416519-B | Organic silicon gel for encapsulating IGBT module | 广州回天新材料有限公司 | 2023-05-02 | — | — | CN | claimed |
| CN-115678286-A | Easily-filled and easily-repaired heat-conducting gel and preparation method thereof | 四川天邑康和通信股份有限公司 | 2023-02-03 | — | — | CN | claimed |
| CN-115109562-A | Bi-component high-heat-dissipation high-conductivity organic silicon pouring sealant and preparation method thereof | 广州市白云化工实业有限公司 | 2022-09-27 | — | — | CN | claimed |
| CN-115058227-A | Addition type organic silicon road adhesive and preparation method thereof | 广州市白云化工实业有限公司 | 2022-09-16 | — | — | CN | claimed |
| CN-114921222-A | Fireproof heat-conducting high-strength stable-performance organic silicon pouring sealant and preparation method thereof | 广东施奈仕实业有限公司 | 2022-08-19 | — | — | CN | claimed |
| CN-113648452-B | In-vivo in-situ foaming material | 北京大学口腔医院 | 2022-08-19 | — | — | CN | claimed |
| CN-111808571-B | High-heat-conductivity organic silicon pouring sealant for photovoltaic inverter | 广州回天新材料有限公司 | 2022-05-10 | — | — | CN | claimed |
| CN-110305581-B | Organic silicon impregnating varnish and preparation method and application thereof | 蚌埠金实科技有限公司 | 2021-12-10 | — | — | CN | claimed |
| CN-103627365-B | High-viscosity high-strength optical transparent organic silicon adhesive and preparation method thereof | YANTAI DEBANG ADVANCED SILICON MATERIALS CO LTD | 2015-06-10 | — | — | CN | claimed |
| CN-104242197-A | High-temperature waterproof bus duct | Jiangsu jiangcheng electric co ltd | 2014-12-24 | — | — | CN | claimed |
| CN-103627365-A | High-viscosity high-strength optical transparent organic silicon adhesive and preparation method thereof | YANTAI DEBANG ADVANCED SILICON MATERIALS CO LTD | 2014-03-12 | — | — | CN | claimed |
| CN-103613931-A | Antistatic organosilicon gel used for heat-conducting gasket and preparation method of the organosilicon gel | YANTAI DEBANG ADVANCED SILICON MATERIALS CO LTD | 2014-03-05 | — | — | CN | claimed |
| EP-0355429-B1 | Method for reducing silicone foam density and silicone foam compositions | GEN ELECTRIC (US) | 1995-01-11 | — | — | EP | claimed |
| US-5315022-A | Sunscreen | SHISEIDO COMPANY LTD. (JP) | 1994-05-24 | — | — | US | claimed |
| EP-0355429-A2 | Method for reducing silicone foam density and silicone foam compositions | GENERAL ELECTRIC COMPANY (US) | 1990-02-28 | — | — | EP | claimed |
| US-4904414-A | DISPERSION OF CROSSLINKED POLYSILOXANES, SILVER PARTICLES, SILICA FILLER | SIEMENS AKTIENGESELLSCHAFT (DE) | 1990-02-27 | — | — | US | claimed |
| EP-0173512-B1 | PLATINUM (0) ALKYNE COMPLEXES AND A METHOD FOR THEIR PREPARATION | DOW CORNING CORPORATION (US) | 1990-01-10 | — | — | EP | claimed |
| US-4840974-A | USING MIXTURE OF PLATINUM VINYL SILOXANE AND PLATINUM TRIARYLPHOSPHINE CATALYST MIXTURE | GENERAL ELECTRIC COMPANY (US) | 1989-06-20 | — | — | US | claimed |