SCHEMBL7058458

SCHEMBL7058458

CC(CCC(F)(F)F)O[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10527981 0.88
SCHEMBL10527400 0.83
SCHEMBL123391 0.74
SCHEMBL2711143 0.72
SCHEMBL26730050 0.70
SCHEMBL9331989 0.69
SCHEMBL231813 0.69
SCHEMBL18634754 0.69
SCHEMBL28066643 0.69
SCHEMBL669083 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12473474-B2 Addition curable silicone adhesive compositions MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2025-11-18 US disclosed
US-11952516-B2 Addition curable silicone adhesive compositions MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2024-04-09 US disclosed
US-20230047848-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. 2023-02-16 US disclosed
EP-4073193-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS Momentive Performance Materials Inc. (US) 2022-10-19 EP disclosed
US-20220119690-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. 2022-04-21 US disclosed
EP-3914638-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS Momentive Performance Materials Inc. (US) 2021-12-01 EP disclosed
WO-2021118582-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2021-06-17 WO disclosed
WO-2020153947-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2020-07-30 WO disclosed
EP-1006118-B1 Method for synthesizing organosilicon compounds that contain a group bonded to silicon across the SI-C bond DOW CORNING ASIA LTD (JP) 2003-05-07 EP disclosed
US-6191220-B1 REACTING POLYMER HAVING OLEFINIC OR ACETYLENIC UNSATURATED GROUPS WITH HYDRIDE (HYDROCARBONOXY) SILANE IN PRESENCE OF PLATINUM OR PLATINUM COMPOUND CATALYST AND SILYLATED CARBOXYLIC ACID TO FORM HYDROCARBONOXYSILYL FUNCTIONAL POLYMER DOW CORNING ASIA, LTD. (JP) 2001-02-20 US disclosed
US-6111126-A Method for synthesizing organosilicon compounds that contain a functional group bonded to silicon across the Si-C bond DOW CORNING ASIA, LTD. (JP) 2000-08-29 US disclosed
EP-1006118-A2 Method for synthesizing organosilicon compounds that contain a group bonded to silicon across the SI-C bond Dow Corning Asia, Ltd. (JP) 2000-06-07 EP disclosed
US-6048994-A Selective hydrosilylation method using hydrido (hydrocarbonoxy) silane DOW CORNING ASIA, LTD. (JP) 2000-04-11 US disclosed
US-5994573-A Method for making triarylamine compounds having hydrocarbonoxysilyl groups DOW CORNING ASIA, LTD. (JP) 1999-11-30 US disclosed
US-5986124-A Method for making compounds containing hydrocarbonoxysilyi groups by hydrosilylation using hydrido (hydrocarbonoxy) silane compounds DOW CORNING ASIA, LTD. (JP) 1999-11-16 US disclosed
US-5907008-A Black coloring composition, high heat resistance light-shielding component, array substrate, liquid crystal and method of manufacturing array substrate KABUSHIKI KAISHA TOSHIBA (JP) 1999-05-25 US disclosed
US-4814407-A A SILANOL, SILANEDIOL OR SILANETRIOL AND AN ACID SCAVENGER PCR, INC. (US) 1989-03-21 US disclosed
US-4649063-A Method for waterproofing silica-ceramic insulation bodies SCM CORPORATION (US) 1987-03-10 US disclosed