Sulfurous Acid

Sulfurous Acid

SCHEMBL706849

C=O.N.O=S(O)O

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5395897-A Reaction of polyacrylic acid with nitrogen to form acrylamide copolymer NALCO CHEMICAL COMPANY (US) 1995-03-07 US claimed
CN-115710701-B Electroless gold plating solution and application 广东东硕科技有限公司 2024-12-10 CN disclosed
CN-115710701-A Chemical gold plating solution and application 广东东硕科技有限公司 2023-02-24 CN disclosed
CN-114164422-A Method for maintaining and managing plating capability of electroless gold plating bath 上村工业株式会社 2022-03-11 CN disclosed
EP-3705601-B1 ELECTROLESS GOLD PLATING BATH UEMURA KOGYO KK (JP) 2021-11-03 EP disclosed
US-10975475-B2 Electroless gold plating bath C. UYEMURA & CO., LTD. (JP) 2021-04-13 US disclosed
CN-111663123-A Electroless gold plating bath 上村工业株式会社 2020-09-15 CN disclosed
US-20200283906-A1 ELECTROLESS GOLD PLATING BATH C. UYEMURA & CO., LTD. (JP) 2020-09-10 US disclosed
EP-3705601-A1 ELECTROLESS GOLD PLATING BATH C. Uyemura & Co., Ltd. (JP) 2020-09-09 EP disclosed
US-8124174-B2 Electroless gold plating method and electronic parts C. UYEMURA & CO., LTD. (JP) 2012-02-28 US disclosed
US-20080277140-A1 ELECTROLESS GOLD PLATING METHOD AND ELECTRONIC PARTS C. UYEMURA & CO., LTD. (JP) 2008-11-13 US disclosed
US-5962204-A Photographic reversal process prebleach concentrate container EASTMAN KODAK COMPANY (US) 1999-10-05 US disclosed
US-5837432-A PROCESSING COLOR SILVER HALIDE PHOTOGRAPHIC ELEMENT WITH CONDITIONING SOLUTION CONCENTRATE COMPRISING FORMALDEHYDE BISULFITE SALT, SULFITE IONS, BLEACH ACCELERATING AGENT, METAL ION CHELATING AGENT EASTMAN KODAK COMPANY (US) 1998-11-17 US disclosed
US-5827636-A NONTOXIC SODIUM-FREE CONDITIONING SOLUTION USE AS FIXING AGENT IN DEVELOPING COLOR PHOTOGRAPHIC FILMS EASTMAN KODAK COMPANY (US) 1998-10-27 US disclosed
US-5395897-A Reaction of polyacrylic acid with nitrogen to form acrylamide copolymer NALCO CHEMICAL COMPANY (US) 1995-03-07 US disclosed
EP-0314083-B1 AN IMPROVED PROCESS FOR MAKING ACRYLAMIDO METHANE SULFONIC ACID POLYMERS NALCO CHEMICAL COMPANY (US) 1993-01-07 EP disclosed
US-4952642-A REACTING POLY(METH)ACRYLIC ACID WITH AMMONIA, FORMALDEHYDE AND WATER-SOLUBLE BISULFITE NALCO CHEMICAL COMPANY (US) 1990-08-28 US disclosed
EP-0314083-A2 An improved process for making acrylamido methane sulfonic acid polymers NALCO CHEMICAL COMPANY (US) 1989-05-03 EP disclosed
US-4795789-A REACTING (METH)ACRYLIC ACID POLYMERS WITH AMMONIA, FORMALDEHYDE AND A BISULFITE NALCO CHEMICAL COMPANY (US) 1989-01-03 US disclosed
US-4276224-A Anthraquinone sulphonamide compounds and preparation CIBA-GEIGY CORPORATION (US) 1981-06-30 US disclosed